Abstract
In response to the application requirements of high performance and miniaturization of compact filters，research was conducted to ensure the reliability of assembled solder joints for wafer-level-packaging （WLP）-encapsulated surface acoustic wave（SAW）filters. A 100 μm diameter solder mask-defined（SMD）pad was designed as the PCB mounting pad，and SAC305 solder paste with a powder size of type 6 was deposited on to the pad via stencil printing to compensate for the dimensional discrepancy of the device solder balls. Through optimized reflow temperature profiling，a soldering assembly between the SAW filter and pad was successfully realized. The electrical performance and reliability of the assembled solder joints were characterized by solder joint inspection，shear testing，metallographic analysis，and environmental testing. The results thus obtained demonstrated that the solder joints of the assembled filters exhibited excellent reliability，making them suitable for widespread applications.
| Translated title of the contribution | Research on the Assembly Reliability of WLP Packaged Filters |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 355-359 |
| Number of pages | 5 |
| Journal | Yadian Yu Shengguang/Piezoelectrics and Acoustooptics |
| Volume | 48 |
| Issue number | 2 |
| DOIs | |
| State | Published - Apr 2026 |
| Externally published | Yes |
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