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Void defect formed in wiping step of gravure printing

  • Z. H. Cen*
  • , X. C. Shan
  • , B. Salam
  • , L. S. Rachel Tan
  • , J. Wei
  • *Corresponding author for this work
  • Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In order to print various functional components for printed electronics, inks with different viscosities may be used in gravure printing. In this study, influence of ink viscosity on gravure printing quality at individual cell level is reported. In gravure printing experiments using dielectric Barium Titanate (BaTiO3) nanoparticles inks of different viscosities, a void defect can be observed at the front edge of the printed pattern of an individual engraved cell. And the void became larger both for ink with higher viscosity and at higher printing speed. In our experiments, it was noticed that the voids can lead to open defects in the whole printed pattern of high viscosity ink, undermining the printing quality. In order to study the forming mechanism of the voids, experimental results were analyzed based on computational fluid dynamic (CFD) simulation studies of wiping step in the gravure printing process. Simulation confirmed that the observed void is caused by the unfilled space at the leading edge of the engraved cell during wiping. Effects of wiping speed and ink viscosity have been investigated, and the simulation results are consistent with experiments. Based on the experimental and theoretical results, it can be concluded that, for gravure printing using high viscosity ink, printing speed needs to be slowed down in order to reduce defects. The present study enhanced understanding of ink transfer in gravure printing and provided a guide line for high quality gravure printing.

Original languageEnglish
Title of host publication2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages722-728
Number of pages7
ISBN (Electronic)9781538676684
DOIs
StatePublished - Dec 2018
Externally publishedYes
Event20th IEEE Electronics Packaging Technology Conference, EPTC 2018 - Singapore, Singapore
Duration: 4 Dec 20187 Dec 2018

Publication series

Name2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018

Conference

Conference20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Country/TerritorySingapore
CitySingapore
Period4/12/187/12/18

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