TY - GEN
T1 - Vibration simulation of transducer system in thermosonic wire bonding
AU - Long, Zhili
AU - Han, Lei
AU - Zhou, Hongquan
AU - Wu, Yunxin
AU - Zhong, Jue
PY - 2006
Y1 - 2006
N2 - The vibration simulation model of transducer system in wire bonding was established by mechanical finite element method and verified by electric sine sweeping exciting method. The results show that, transducer system of wire bonder works with its second combination vibration mode that includes three nodes axial vibration of concentrator and one node radial vibration of capillary. There are many other undesirable modes that may be excited because they are very close to working frequency. These undesirable modes would waste ultrasonic energy and badly influence to bonding quality between gold ball and substrate, so they should be well controlled in bonding. Good agreement between simulation and experimental result was obtained, where the computed error of working frequency is only 1.2%. The research result can be used in performance study and design of an ultrasonic transducer.
AB - The vibration simulation model of transducer system in wire bonding was established by mechanical finite element method and verified by electric sine sweeping exciting method. The results show that, transducer system of wire bonder works with its second combination vibration mode that includes three nodes axial vibration of concentrator and one node radial vibration of capillary. There are many other undesirable modes that may be excited because they are very close to working frequency. These undesirable modes would waste ultrasonic energy and badly influence to bonding quality between gold ball and substrate, so they should be well controlled in bonding. Good agreement between simulation and experimental result was obtained, where the computed error of working frequency is only 1.2%. The research result can be used in performance study and design of an ultrasonic transducer.
KW - FEM simulation model
KW - Thermosonic wire bonding
KW - Transducer system
KW - Vibration characteristics
UR - https://www.scopus.com/pages/publications/42749104285
U2 - 10.1109/HDP.2005.251439
DO - 10.1109/HDP.2005.251439
M3 - 会议稿件
AN - SCOPUS:42749104285
SN - 0780392930
SN - 9780780392939
T3 - 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
BT - 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
T2 - 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
Y2 - 27 June 2005 through 29 June 2005
ER -