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Understanding of the static contact behaviors of rod and spring for microelectromechanical relay

  • School of Electrical Engineering and Automation, Harbin Institute of Technology
  • Ltd.

Research output: Contribution to journalArticlepeer-review

Abstract

The structure configuration of rod and spring contacts is widely used in the microelectromechanical relay. Low and stable electrical contact resistance is a fundamental requirement for reliability and electrical life of relays. In this paper, a theoretical model of rod and spring is presented to calculate the constriction resistance and compared with the classical Holm's models. Furthermore, the relationship between electrical contact resistance and contact force of rod and spring is investigated explicitly with our designed test rig. A power law for contact resistance versus contact force Rc=KF- m is established. A schematic model of contact pair with a rough surface is introduced to explain the variation of contact resistance during the loading process. In particular, the transition phenomena from the initial single contact asperity to the whole rectangular contact area are analyzed. Finally, the effects of surface roughness of the Au coating and operating cycles on the static contact behavior are also discussed.

Original languageEnglish
Article number8727502
Pages (from-to)2366-2373
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume9
Issue number12
DOIs
StatePublished - Dec 2019
Externally publishedYes

Keywords

  • Contact asperity
  • contact resistance
  • line contact
  • microelectromechanical relay
  • surface roughness

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