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Understanding creep behavior of carbon fiber/epoxy interface via molecular dynamics simulation

  • Lik ho Tam
  • , Ruidong Wu
  • , Marc A.Ntjam Minkeng
  • , Jinqiao Jiang
  • , Ao Zhou
  • , Huali Hao
  • , Zechuan Yu*
  • , Chao Wu*
  • *Corresponding author for this work
  • Beihang University
  • Harbin Institute of Technology Shenzhen
  • Wuhan University
  • Wuhan University of Technology
  • Imperial College London

Research output: Contribution to journalArticlepeer-review

Abstract

This work focuses on molecular creep behavior of carbon fiber/epoxy interface under sustained loads at different levels. Threshold stress and energy barrier for the onset of interfacial creep failure under peeling loads are found greater than those under shearing. Microstructural changes during creep show that the epoxy has a large and irreversible deformation under peeling loads, denoted as a yielding process in the peeling case. The yielding process in the peeling case dissipates the applied energy in the epoxy structure. Therefore, the interface shows a stronger resistance to the peeling and the shearing is more critical during composite failure.

Original languageEnglish
Pages (from-to)4052-4064
Number of pages13
JournalMechanics of Advanced Materials and Structures
Volume30
Issue number19
DOIs
StatePublished - 2023
Externally publishedYes

Keywords

  • Carbon fiber-reinforced composites
  • interfacial creep
  • molecular dynamics simulation
  • peeling
  • shearing
  • sustained loads

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