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Ultrawide Bandgap Diamond/ϵ-Ga2O3 Heterojunction pn Diodes with Breakdown Voltages over 3 kV

  • Jianguo Zhang
  • , Ningtao Liu
  • , Li Chen
  • , Xun Yang*
  • , Haizhong Guo
  • , Zefeng Wang
  • , Ming Qian Yuan
  • , Xue Jun Yan
  • , Jianqun Yang
  • , Xingji Li
  • , Chongxin Shan*
  • , Jichun Ye*
  • , Wenrui Zhang*
  • *Corresponding author for this work
  • CAS - Ningbo Institute of Material Technology and Engineering
  • University of Chinese Academy of Sciences
  • Zhengzhou University
  • Harbin Institute of Technology
  • Nanjing University
  • Yongjiang Laboratory

Research output: Contribution to journalArticlepeer-review

Abstract

Robust bipolar devices based on exclusively ultrawide bandgap (UWBG) semiconductors are highly desired for advanced power electronics. The heterojunction strategy has been a prevailing method for fabricating a bipolar device due to the lack of effective bipolar doping in the same UWBG material. Here, we demonstrate a unique heterojunction design integrating the p-type diamond and n-type ϵ-Ga2O3 that achieves remarkable breakdown voltages surpassing 3000 V. Despite the lattice mismatch, the heteroepitaxial ϵ-Ga2O3 film is established on the diamond substrate, forming an atomically sharp interface with C-O-Ga bonding and enabling the O-terminated diamond surface for constructing an effective rectifying heterojunction. The ultra-high-quality interface, together with the lightly doped diamond as the drift layer, largely weakens the commonly met electric field crowding effect in power diodes and provides a cost-effective thermal management route. This study provides an efficient heterojunction design to realize the potential of UWBG semiconductors for ultra-high-power applications.

Original languageEnglish
Pages (from-to)537-544
Number of pages8
JournalNano Letters
Volume25
Issue number1
DOIs
StatePublished - 8 Jan 2025
Externally publishedYes

Keywords

  • diamond
  • heterojunction diode
  • power device
  • thermal boundary conductance
  • ϵ-GaO

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