Ultrasonic-Induced Rapid Spreading of Zn Droplet on TC4 Substrate and Zn/Ti Interaction at the Bonding Interface

Tao Li; Yuanbiao Cui; Wancun Liu; Yuding Liu; Zhengwei Li; Zhiwu Xu; Jiuchun Yan

doi:10.1007/s11665-025-12058-9

Ultrasonic-Induced Rapid Spreading of Zn Droplet on TC4 Substrate and Zn/Ti Interaction at the Bonding Interface

Tao Li
, Yuanbiao Cui
, Wancun Liu
, Yuding Liu
, Zhengwei Li^*
, Zhiwu Xu^*
, Jiuchun Yan

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Vocational & Technical College
Harbin Huade University
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

Abstract

In this work, the spreading behavior of a Zn solder droplet on TC4 sheet with the help of ultrasonic was studied. Results show that the solder spreads rapidly with the help of ultrasonic due to the high acoustic pressure formed in the droplet center. The spreading center shows complete wetting, while the near-center-region shows spot wetting when using short ultrasonic time. Prolonging the ultrasonic action time contributes the interaction of Zn and Ti at the spreading center, forming intermetallic compound (IMC). The oxide layer remains intact at the spreading front when changing ultrasonic times. Thick IMCs with cracks form when using ultrasonic time longer than 5 s. TC4 substrate and TiZn₃ have similar hardness, TiZn₃ and TiZn IMC have similar modulus.

Original language	English
Pages (from-to)	28745-28756
Number of pages	12
Journal	Journal of Materials Engineering and Performance
Volume	34
Issue number	23
DOIs	https://doi.org/10.1007/s11665-025-12058-9
State	Published - Dec 2025

Keywords

acoustic pressure
hardness
intermetallic compound
spreading
ultrasonic

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10.1007/s11665-025-12058-9

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title = "Ultrasonic-Induced Rapid Spreading of Zn Droplet on TC4 Substrate and Zn/Ti Interaction at the Bonding Interface",

abstract = "In this work, the spreading behavior of a Zn solder droplet on TC4 sheet with the help of ultrasonic was studied. Results show that the solder spreads rapidly with the help of ultrasonic due to the high acoustic pressure formed in the droplet center. The spreading center shows complete wetting, while the near-center-region shows spot wetting when using short ultrasonic time. Prolonging the ultrasonic action time contributes the interaction of Zn and Ti at the spreading center, forming intermetallic compound (IMC). The oxide layer remains intact at the spreading front when changing ultrasonic times. Thick IMCs with cracks form when using ultrasonic time longer than 5 s. TC4 substrate and TiZn3 have similar hardness, TiZn3 and TiZn IMC have similar modulus.",

keywords = "acoustic pressure, hardness, intermetallic compound, spreading, ultrasonic",

author = "Tao Li and Yuanbiao Cui and Wancun Liu and Yuding Liu and Zhengwei Li and Zhiwu Xu and Jiuchun Yan",

note = "Publisher Copyright: {\textcopyright} ASM International 2025.",

year = "2025",

month = dec,

doi = "10.1007/s11665-025-12058-9",

language = "英语",

volume = "34",

pages = "28745--28756",

journal = "Journal of Materials Engineering and Performance",

issn = "1059-9495",

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TY - JOUR

T1 - Ultrasonic-Induced Rapid Spreading of Zn Droplet on TC4 Substrate and Zn/Ti Interaction at the Bonding Interface

AU - Li, Tao

AU - Cui, Yuanbiao

AU - Liu, Wancun

AU - Liu, Yuding

AU - Li, Zhengwei

AU - Xu, Zhiwu

AU - Yan, Jiuchun

N1 - Publisher Copyright: © ASM International 2025.

PY - 2025/12

Y1 - 2025/12

N2 - In this work, the spreading behavior of a Zn solder droplet on TC4 sheet with the help of ultrasonic was studied. Results show that the solder spreads rapidly with the help of ultrasonic due to the high acoustic pressure formed in the droplet center. The spreading center shows complete wetting, while the near-center-region shows spot wetting when using short ultrasonic time. Prolonging the ultrasonic action time contributes the interaction of Zn and Ti at the spreading center, forming intermetallic compound (IMC). The oxide layer remains intact at the spreading front when changing ultrasonic times. Thick IMCs with cracks form when using ultrasonic time longer than 5 s. TC4 substrate and TiZn3 have similar hardness, TiZn3 and TiZn IMC have similar modulus.

AB - In this work, the spreading behavior of a Zn solder droplet on TC4 sheet with the help of ultrasonic was studied. Results show that the solder spreads rapidly with the help of ultrasonic due to the high acoustic pressure formed in the droplet center. The spreading center shows complete wetting, while the near-center-region shows spot wetting when using short ultrasonic time. Prolonging the ultrasonic action time contributes the interaction of Zn and Ti at the spreading center, forming intermetallic compound (IMC). The oxide layer remains intact at the spreading front when changing ultrasonic times. Thick IMCs with cracks form when using ultrasonic time longer than 5 s. TC4 substrate and TiZn3 have similar hardness, TiZn3 and TiZn IMC have similar modulus.

KW - acoustic pressure

KW - hardness

KW - intermetallic compound

KW - spreading

KW - ultrasonic

UR - https://www.scopus.com/pages/publications/105016603476

U2 - 10.1007/s11665-025-12058-9

DO - 10.1007/s11665-025-12058-9

M3 - 文章

AN - SCOPUS:105016603476

SN - 1059-9495

VL - 34

SP - 28745

EP - 28756

JO - Journal of Materials Engineering and Performance

JF - Journal of Materials Engineering and Performance

IS - 23

ER -

Ultrasonic-Induced Rapid Spreading of Zn Droplet on TC4 Substrate and Zn/Ti Interaction at the Bonding Interface

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Keywords

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