@inproceedings{204643a5eb264f10a9bd02f8151b1b99,
title = "Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application",
abstract = "This paper describes a new method to achieve rapid formation of intermetallic phases joints for hightemperature packaging application. A high-melting-point joint which consists of (Cu,Ni)6Sn5 and Cu3Sn was formed without flux in air with a high shear strength of 67 MPa was obtained at the conditions of 500 W ultrasonic power for 10 s. Compared with other studies based on transient-liquid-phase soldering, the processing time of our method was dramatically reduced from several hours to several seconds and there was no external force acted on chips.",
keywords = "Die bonding, Intermetallic joint, Shear strength, Ultrasonic-assisted soldering",
author = "Hongjun Ji and Yunfei Qiao and Mingyu Li",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 16th International Conference on Electronic Packaging Technology, ICEPT 2015 ; Conference date: 11-08-2015 Through 14-08-2015",
year = "2015",
month = sep,
day = "1",
doi = "10.1109/ICEPT.2015.7236650",
language = "英语",
series = "16th International Conference on Electronic Packaging Technology, ICEPT 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "564--567",
editor = "Hu He and Keyun Bi and Wenhui Zhu",
booktitle = "16th International Conference on Electronic Packaging Technology, ICEPT 2015",
address = "美国",
}