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Ultraprecision 3D probing system based on spherical capacitive plate

  • J. B. Tan
  • , J. N. Cui*
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

In order to make ultraprecision dimensional and profile measurement of small structures with large aspect ratio possible, a 3D probing system based on a spherical capacitive plate is proposed for use in making 3D non-contact probing at nanometer resolution. A spherical capacitive plate with identical sensing characteristic in any arbitrary spatial direction is used to convert the micro gap between the plate and the part being measured into a capacitive signal. Most of the electric lines of force of the spherical capacitive plate concentrate within a small region between the plate and the part being measured, so that the properties of 3D non-contact probing, isotropy characteristics, approximate point sensing and measurability of small structures with large aspect ratio are effectively combined in one probing system. Experimental results indicate that when a 3 mm probing head is used, the probing system has a resolution of better than 5 nm. With nonlinearity corrected, the residual nonlinear error is less than 10 nm in the full-range. The proposed system can therefore be used for submicron measurement of small structures with dimension larger than 3 mm and depth down to 100 mm.

Original languageEnglish
Pages (from-to)1-6
Number of pages6
JournalSensors and Actuators A: Physical
Volume159
Issue number1
DOIs
StatePublished - Apr 2010

Keywords

  • 3D
  • Capacitive
  • Non-contact
  • Probing system
  • Ultraprecision

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