Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique

Fei Wang; Xinxin Li; Rong Cheng; Heng Yang; Yuelin Wang; Songlin Feng; Xiaohong Ge; Tao Chen; Liguo Chen; Lining Sun

doi:10.1109/MEMSYS.2008.4443663

Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique

Fei Wang^*
, Xinxin Li
, Rong Cheng
, Heng Yang
, Yuelin Wang
, Songlin Feng
, Xiaohong Ge
, Tao Chen
, Liguo Chen
, Lining Sun

^*Corresponding author for this work

School of Mechatronics Engineering

CAS - Shanghai Institute of Microsystem and Information Technology
Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Scopus citations

Abstract

Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240μmx160μm. The "hoe-shaped" microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining techniques including electroplating. The measured spring constants for all the three types of designed probes agree well with the designed values. As both mechanical and electrical interconnections, the Sn/Ag solder-bumps feature excellent properties. The tested contact resistance values are always below 0.8Ω, while the current leakage between two adjacent probes is only 150pA under 3.3V.

Original language	English
Title of host publication	MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages	343-346
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2008.4443663
State	Published - 2008
Event	21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States Duration: 13 Jan 2008 → 17 Jan 2008

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
Country/Territory	United States
City	Tucson, AZ
Period	13/01/08 → 17/01/08

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10.1109/MEMSYS.2008.4443663

Cite this

Wang, F., Li, X., Cheng, R., Yang, H., Wang, Y., Feng, S., Ge, X., Chen, T., Chen, L., & Sun, L. (2008). Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 343-346). Article 4443663 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443663

@inproceedings{25998c9253f2453da6e4910aed7cf25b,

title = "Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique",

abstract = "Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240μmx160μm. The {"}hoe-shaped{"} microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining techniques including electroplating. The measured spring constants for all the three types of designed probes agree well with the designed values. As both mechanical and electrical interconnections, the Sn/Ag solder-bumps feature excellent properties. The tested contact resistance values are always below 0.8Ω, while the current leakage between two adjacent probes is only 150pA under 3.3V.",

author = "Fei Wang and Xinxin Li and Rong Cheng and Heng Yang and Yuelin Wang and Songlin Feng and Xiaohong Ge and Tao Chen and Liguo Chen and Lining Sun",

year = "2008",

doi = "10.1109/MEMSYS.2008.4443663",

language = "英语",

isbn = "9781424417933",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "343--346",

booktitle = "MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems",

note = "21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson ; Conference date: 13-01-2008 Through 17-01-2008",

}

Wang, F, Li, X, Cheng, R, Yang, H, Wang, Y, Feng, S, Ge, X, Chen, T, Chen, L & Sun, L 2008, Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique. in MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems., 4443663, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 343-346, 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson, Tucson, AZ, United States, 13/01/08. https://doi.org/10.1109/MEMSYS.2008.4443663

Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique. / Wang, Fei; Li, Xinxin; Cheng, Rong et al.
MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. p. 343-346 4443663 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique

AU - Wang, Fei

AU - Li, Xinxin

AU - Cheng, Rong

AU - Yang, Heng

AU - Wang, Yuelin

AU - Feng, Songlin

AU - Ge, Xiaohong

AU - Chen, Tao

AU - Chen, Liguo

AU - Sun, Lining

PY - 2008

Y1 - 2008

N2 - Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240μmx160μm. The "hoe-shaped" microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining techniques including electroplating. The measured spring constants for all the three types of designed probes agree well with the designed values. As both mechanical and electrical interconnections, the Sn/Ag solder-bumps feature excellent properties. The tested contact resistance values are always below 0.8Ω, while the current leakage between two adjacent probes is only 150pA under 3.3V.

AB - Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240μmx160μm. The "hoe-shaped" microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining techniques including electroplating. The measured spring constants for all the three types of designed probes agree well with the designed values. As both mechanical and electrical interconnections, the Sn/Ag solder-bumps feature excellent properties. The tested contact resistance values are always below 0.8Ω, while the current leakage between two adjacent probes is only 150pA under 3.3V.

UR - https://www.scopus.com/pages/publications/50149107966

U2 - 10.1109/MEMSYS.2008.4443663

DO - 10.1109/MEMSYS.2008.4443663

M3 - 会议稿件

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SN - 9781424417933

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

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BT - MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems

T2 - 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson

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ER -

Wang F, Li X, Cheng R, Yang H, Wang Y, Feng S et al. Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. p. 343-346. 4443663. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2008.4443663

Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique

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