Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding

Shang Wang; He Zhang; Yue Li; Weiwei Zhang; Chunjin Hang; Yanhong Tian

doi:10.1016/j.matlet.2021.129340

Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding

Shang Wang
, He Zhang
, Yue Li
, Weiwei Zhang
, Chunjin Hang
, Yanhong Tian^*

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
China Academy of Engineering Physics

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance welding were observed by transmission electron microscopy (TEM). Obvious Al, Au and Cu elemental interdiffusion can be observed by energy dispersive spectrometer (EDS) mapping, indicating the occurring of sufficient interfacial reaction. Under the effect of current and heat, the core temperature is higher than the melting point of Al. Liquid Al will react with Au and (Au, Cu) Al₂ intermetallic compound (IMC) phase was formed rapidly within 20 ms. Besides, excessive Al atoms rapidly diffuse through the Cu-based solid solution, and react with Cu forming (Cu, Au) Al₄ IMC phase.

Original language	English
Article number	129340
Journal	Materials Letters
Volume	288
DOIs	https://doi.org/10.1016/j.matlet.2021.129340
State	Published - 1 Apr 2021

Keywords

Electronic materials
Interfaces
Intermetallic alloys and compounds
Metals and alloys
Parallel gap micro-resistance welding

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10.1016/j.matlet.2021.129340

Cite this

@article{66abcc791aa54fd99275edbcc59fa275,

title = "Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding",

abstract = "Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance welding were observed by transmission electron microscopy (TEM). Obvious Al, Au and Cu elemental interdiffusion can be observed by energy dispersive spectrometer (EDS) mapping, indicating the occurring of sufficient interfacial reaction. Under the effect of current and heat, the core temperature is higher than the melting point of Al. Liquid Al will react with Au and (Au, Cu) Al2 intermetallic compound (IMC) phase was formed rapidly within 20 ms. Besides, excessive Al atoms rapidly diffuse through the Cu-based solid solution, and react with Cu forming (Cu, Au) Al4 IMC phase.",

keywords = "Electronic materials, Interfaces, Intermetallic alloys and compounds, Metals and alloys, Parallel gap micro-resistance welding",

author = "Shang Wang and He Zhang and Yue Li and Weiwei Zhang and Chunjin Hang and Yanhong Tian",

note = "Publisher Copyright: {\textcopyright} 2021 Elsevier B.V.",

year = "2021",

month = apr,

day = "1",

doi = "10.1016/j.matlet.2021.129340",

language = "英语",

volume = "288",

journal = "Materials Letters",

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}

TY - JOUR

T1 - Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding

AU - Wang, Shang

AU - Zhang, He

AU - Li, Yue

AU - Zhang, Weiwei

AU - Hang, Chunjin

AU - Tian, Yanhong

PY - 2021/4/1

Y1 - 2021/4/1

N2 - Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance welding were observed by transmission electron microscopy (TEM). Obvious Al, Au and Cu elemental interdiffusion can be observed by energy dispersive spectrometer (EDS) mapping, indicating the occurring of sufficient interfacial reaction. Under the effect of current and heat, the core temperature is higher than the melting point of Al. Liquid Al will react with Au and (Au, Cu) Al2 intermetallic compound (IMC) phase was formed rapidly within 20 ms. Besides, excessive Al atoms rapidly diffuse through the Cu-based solid solution, and react with Cu forming (Cu, Au) Al4 IMC phase.

AB - Reliable bonding of thick Al wires and plated Au pad is important for the packaging of power modules. The interfacial phases of the Al/Au/Cu joint after parallel gap micro-resistance welding were observed by transmission electron microscopy (TEM). Obvious Al, Au and Cu elemental interdiffusion can be observed by energy dispersive spectrometer (EDS) mapping, indicating the occurring of sufficient interfacial reaction. Under the effect of current and heat, the core temperature is higher than the melting point of Al. Liquid Al will react with Au and (Au, Cu) Al2 intermetallic compound (IMC) phase was formed rapidly within 20 ms. Besides, excessive Al atoms rapidly diffuse through the Cu-based solid solution, and react with Cu forming (Cu, Au) Al4 IMC phase.

KW - Electronic materials

KW - Interfaces

KW - Intermetallic alloys and compounds

KW - Metals and alloys

KW - Parallel gap micro-resistance welding

UR - https://www.scopus.com/pages/publications/85099711112

U2 - 10.1016/j.matlet.2021.129340

DO - 10.1016/j.matlet.2021.129340

M3 - 文章

AN - SCOPUS:85099711112

SN - 0167-577X

VL - 288

JO - Materials Letters

JF - Materials Letters

M1 - 129340

ER -

Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding

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Keywords

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