Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint

Peng Xue; Kehong Wang; Qi Zhou; Peng He; Weimin Long; Sujuan Zhong

Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint

Peng Xue
, Kehong Wang
, Qi Zhou^*
, Peng He
, Weimin Long
, Sujuan Zhong

^*Corresponding author for this work

School of Materials Science and Engineering

Nanjing University of Science and Technology
Zhengzhou Research Institute of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

The interfacial microstructure in Sn-Zn-Nd solder joint aged at 360 hours, 720 hours, and 3 000 hours was investigated respectively. The results indicated that the transformation of interfacial intermetallic compound layer was dominated by the atom diffusion. After long-term aging, the composition of intermetallic compound layer transformed from Cu5Zn8 into a mixed Cu-Zn-Sn compounds. During the aging process, the diffusion-induced stresses also accumulated at the interface between solder matrix and Cu pad. When it reached a certain value, voids and fractures was formed in the intermetallic compound layer, which deteriorated the soldered joint properties.

Original language	English
Pages (from-to)	33-36
Number of pages	4
Journal	Hanjie Xuebao/Transactions of the China Welding Institution
Volume	37
Issue number	1
State	Published - 25 Jan 2016

Keywords

Interface
Intermetallic compound
Sn-Zn
Solder joint

Cite this

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title = "Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint",

abstract = "The interfacial microstructure in Sn-Zn-Nd solder joint aged at 360 hours, 720 hours, and 3 000 hours was investigated respectively. The results indicated that the transformation of interfacial intermetallic compound layer was dominated by the atom diffusion. After long-term aging, the composition of intermetallic compound layer transformed from Cu5Zn8 into a mixed Cu-Zn-Sn compounds. During the aging process, the diffusion-induced stresses also accumulated at the interface between solder matrix and Cu pad. When it reached a certain value, voids and fractures was formed in the intermetallic compound layer, which deteriorated the soldered joint properties.",

keywords = "Interface, Intermetallic compound, Sn-Zn, Solder joint",

author = "Peng Xue and Kehong Wang and Qi Zhou and Peng He and Weimin Long and Sujuan Zhong",

year = "2016",

month = jan,

day = "25",

language = "英语",

volume = "37",

pages = "33--36",

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publisher = "Harbin Research Institute of Welding",

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TY - JOUR

T1 - Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint

AU - Xue, Peng

AU - Wang, Kehong

AU - Zhou, Qi

AU - He, Peng

AU - Long, Weimin

AU - Zhong, Sujuan

PY - 2016/1/25

Y1 - 2016/1/25

N2 - The interfacial microstructure in Sn-Zn-Nd solder joint aged at 360 hours, 720 hours, and 3 000 hours was investigated respectively. The results indicated that the transformation of interfacial intermetallic compound layer was dominated by the atom diffusion. After long-term aging, the composition of intermetallic compound layer transformed from Cu5Zn8 into a mixed Cu-Zn-Sn compounds. During the aging process, the diffusion-induced stresses also accumulated at the interface between solder matrix and Cu pad. When it reached a certain value, voids and fractures was formed in the intermetallic compound layer, which deteriorated the soldered joint properties.

AB - The interfacial microstructure in Sn-Zn-Nd solder joint aged at 360 hours, 720 hours, and 3 000 hours was investigated respectively. The results indicated that the transformation of interfacial intermetallic compound layer was dominated by the atom diffusion. After long-term aging, the composition of intermetallic compound layer transformed from Cu5Zn8 into a mixed Cu-Zn-Sn compounds. During the aging process, the diffusion-induced stresses also accumulated at the interface between solder matrix and Cu pad. When it reached a certain value, voids and fractures was formed in the intermetallic compound layer, which deteriorated the soldered joint properties.

KW - Interface

KW - Intermetallic compound

KW - Sn-Zn

KW - Solder joint

UR - https://www.scopus.com/pages/publications/84959094494

M3 - 文章

AN - SCOPUS:84959094494

SN - 0253-360X

VL - 37

SP - 33

EP - 36

JO - Hanjie Xuebao/Transactions of the China Welding Institution

JF - Hanjie Xuebao/Transactions of the China Welding Institution

IS - 1

ER -

Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint

Abstract

Keywords

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