TY - GEN
T1 - Topological Analysis and Optimization Method Research on Thermal Circuit Matrix of Sealed Electromagnetic Relay
AU - Li, Bo
AU - Han, Yingzhu
AU - Liang, Huimin
AU - Zhu, Mengtong
AU - Wang, Aobo
N1 - Publisher Copyright:
© Beijing Paike Culture Commu. Co., Ltd. 2024.
PY - 2024
Y1 - 2024
N2 - Small sealed electromagnetic relay is a type of commonly used micro switching devices in the aerospace field. Efficient thermal analysis methods are required in the design and analysis process. For finite element method (FEM) for relay temperature simulation has a complex boundary setting and takes long time to build model and solve. When handling multi-dimensional calculations, FEM has a low adaptability to design processes of a complex systems. This article provides a design method from the perspective of matrix transformation - inverse thermal path model - temperature rise calculation - scheme comparison - product implementation. Based on the principle of thermal circuit, a thermal circuit basic unit was established, and its thermal network was abstractly established for a typical 1/2 crystal case sealed electromagnetic relay; Build an experimental system for testing, compare the experimental data with the calculated data of the thermal network model, and verify the correctness of the thermal network model. Based on the topology analysis method, the thermal circuit topology model of the electromagnetic relay was analyzed. Searching for reasonable potential thermal paths in relay design and proposing optimization solutions. Based on the optimization scheme, the topology model of the thermal path matrix is inverted back into the thermal path, and the temperature rise of different optimization design schemes is calculated using a heat transfer equation set. Applying this method to the aforementioned typical 1/2 crystal case sealed electromagnetic relay, multiple optimization design schemes for the product were quickly obtained, and the product optimization design was completed, greatly improving the efficiency of thermal analysis and design.
AB - Small sealed electromagnetic relay is a type of commonly used micro switching devices in the aerospace field. Efficient thermal analysis methods are required in the design and analysis process. For finite element method (FEM) for relay temperature simulation has a complex boundary setting and takes long time to build model and solve. When handling multi-dimensional calculations, FEM has a low adaptability to design processes of a complex systems. This article provides a design method from the perspective of matrix transformation - inverse thermal path model - temperature rise calculation - scheme comparison - product implementation. Based on the principle of thermal circuit, a thermal circuit basic unit was established, and its thermal network was abstractly established for a typical 1/2 crystal case sealed electromagnetic relay; Build an experimental system for testing, compare the experimental data with the calculated data of the thermal network model, and verify the correctness of the thermal network model. Based on the topology analysis method, the thermal circuit topology model of the electromagnetic relay was analyzed. Searching for reasonable potential thermal paths in relay design and proposing optimization solutions. Based on the optimization scheme, the topology model of the thermal path matrix is inverted back into the thermal path, and the temperature rise of different optimization design schemes is calculated using a heat transfer equation set. Applying this method to the aforementioned typical 1/2 crystal case sealed electromagnetic relay, multiple optimization design schemes for the product were quickly obtained, and the product optimization design was completed, greatly improving the efficiency of thermal analysis and design.
KW - Electromagnetic Relay
KW - Thermal Networks
KW - Thermal Performance
KW - Topology Analysis
UR - https://www.scopus.com/pages/publications/85190392159
U2 - 10.1007/978-981-97-1420-9_31
DO - 10.1007/978-981-97-1420-9_31
M3 - 会议稿件
AN - SCOPUS:85190392159
SN - 9789819714193
T3 - Lecture Notes in Electrical Engineering
SP - 284
EP - 295
BT - The Proceedings of the 18th Annual Conference of China Electrotechnical Society - Volume 3
A2 - Yang, Qingxin
A2 - Li, Zewen
A2 - Luo, An
PB - Springer Science and Business Media Deutschland GmbH
T2 - 18th Annual Conference of China Electrotechnical Society, ACCES 2023
Y2 - 15 September 2023 through 17 September 2023
ER -