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Topological Analysis and Optimization Method Research on Thermal Circuit Matrix of Sealed Electromagnetic Relay

  • Bo Li
  • , Yingzhu Han
  • , Huimin Liang*
  • , Mengtong Zhu
  • , Aobo Wang
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • The 14 Th Research Institute of CETC

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Small sealed electromagnetic relay is a type of commonly used micro switching devices in the aerospace field. Efficient thermal analysis methods are required in the design and analysis process. For finite element method (FEM) for relay temperature simulation has a complex boundary setting and takes long time to build model and solve. When handling multi-dimensional calculations, FEM has a low adaptability to design processes of a complex systems. This article provides a design method from the perspective of matrix transformation - inverse thermal path model - temperature rise calculation - scheme comparison - product implementation. Based on the principle of thermal circuit, a thermal circuit basic unit was established, and its thermal network was abstractly established for a typical 1/2 crystal case sealed electromagnetic relay; Build an experimental system for testing, compare the experimental data with the calculated data of the thermal network model, and verify the correctness of the thermal network model. Based on the topology analysis method, the thermal circuit topology model of the electromagnetic relay was analyzed. Searching for reasonable potential thermal paths in relay design and proposing optimization solutions. Based on the optimization scheme, the topology model of the thermal path matrix is inverted back into the thermal path, and the temperature rise of different optimization design schemes is calculated using a heat transfer equation set. Applying this method to the aforementioned typical 1/2 crystal case sealed electromagnetic relay, multiple optimization design schemes for the product were quickly obtained, and the product optimization design was completed, greatly improving the efficiency of thermal analysis and design.

Original languageEnglish
Title of host publicationThe Proceedings of the 18th Annual Conference of China Electrotechnical Society - Volume 3
EditorsQingxin Yang, Zewen Li, An Luo
PublisherSpringer Science and Business Media Deutschland GmbH
Pages284-295
Number of pages12
ISBN (Print)9789819714193
DOIs
StatePublished - 2024
Event18th Annual Conference of China Electrotechnical Society, ACCES 2023 - Nanchang, China
Duration: 15 Sep 202317 Sep 2023

Publication series

NameLecture Notes in Electrical Engineering
Volume1180 LNEE
ISSN (Print)1876-1100
ISSN (Electronic)1876-1119

Conference

Conference18th Annual Conference of China Electrotechnical Society, ACCES 2023
Country/TerritoryChina
CityNanchang
Period15/09/2317/09/23

Keywords

  • Electromagnetic Relay
  • Thermal Networks
  • Thermal Performance
  • Topology Analysis

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