Tool wear mechanism involved in diamond turning of single crystal silicon

In order to find out the mechanism of heavy wear of flank face of diamond cutting tool involved in diamond turning of single crystal silicon, a large number of fly cutting tests were carried out on the crystalline plane (111) of single crystal silicon, and subsequently the X-ray photoelectron spectroscopy (XPS) technology was employed to detect the chemical components of the machined silicon surfaces. The experimental results indicate that the diffusion of carbon atoms of diamond cutting tool takes place due to the high temperature and high pressure within the cutting region. Besides, two micro hard particles, i.e. the silicon carbide (SiC) and diamond-like carbon, come into being in the cutting process, which don't disappear with the gradual increase of the cutting length. As a result, the hard particles will scratch and plough the flank face of diamond cutting tool so as to form the groove marks, which result directly in the heavy tool wear.