Abstract
In order to join alumina ceramic to 5A05 aluminum alloy and obtain the excellent airtightness of joints whose maximum service temperature is 623 K, transient liquid phase (TLP) bonding technique was investigated using Ag-Cu-Ti alloy as interlayer. The wetting experimental results confirm that Ti can react with alumina ceramic at 833 K by adding 2 wt.% Ti in Sn. But during bonding alumina ceramic and 5A05 aluminum alloy with Ag-Cu-Ti interlayer at 833 K, Ti preferentially reacts with Al and there is no reaction layer on alumina ceramic/Ag-Cu-Ti interface, which finally results in a poorly airtight joint.
| Original language | English |
|---|---|
| Pages (from-to) | 39-42 |
| Number of pages | 4 |
| Journal | China Welding (English Edition) |
| Volume | 18 |
| Issue number | 4 |
| State | Published - Dec 2009 |
Keywords
- 5A05 aluminum alloy
- Ag-Cu-Ti interlayer
- Alumina ceramic
- Transient liquid phase bonding
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