Tin whisker growth inhibition in RE-doped Sn-Zn soldered joints

Peng Xue; Weiliang Liang; Peng He; Katsuaki Suganuma; Hao Zhang

doi:10.3390/app9071406

Tin whisker growth inhibition in RE-doped Sn-Zn soldered joints

Peng Xue
, Weiliang Liang
, Peng He^*
, Katsuaki Suganuma
, Hao Zhang

^*Corresponding author for this work

School of Materials Science and Engineering

Nanjing University of Science and Technology
The University of Osaka

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn ₃ phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.

Original language	English
Article number	1406
Journal	Applied Sciences (Switzerland)
Volume	9
Issue number	7
DOIs	https://doi.org/10.3390/app9071406
State	Published - 1 Apr 2019

Keywords

Aging treatment
RE-doped
Soldered joints
Tin whisker inhibition

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10.3390/app9071406

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title = "Tin whisker growth inhibition in RE-doped Sn-Zn soldered joints",

abstract = " The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn 3 phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.",

keywords = "Aging treatment, RE-doped, Soldered joints, Tin whisker inhibition",

author = "Peng Xue and Weiliang Liang and Peng He and Katsuaki Suganuma and Hao Zhang",

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T1 - Tin whisker growth inhibition in RE-doped Sn-Zn soldered joints

AU - Xue, Peng

AU - Liang, Weiliang

AU - He, Peng

AU - Suganuma, Katsuaki

AU - Zhang, Hao

PY - 2019/4/1

Y1 - 2019/4/1

N2 - The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn 3 phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.

AB - The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 °C, with the proper addition ratio of Ga and Nd, no obvious NdSn 3 phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.

KW - Aging treatment

KW - RE-doped

KW - Soldered joints

KW - Tin whisker inhibition

UR - https://www.scopus.com/pages/publications/85064074435

U2 - 10.3390/app9071406

DO - 10.3390/app9071406

M3 - 文章

AN - SCOPUS:85064074435

SN - 2076-3417

VL - 9

JO - Applied Sciences (Switzerland)

JF - Applied Sciences (Switzerland)

IS - 7

M1 - 1406

ER -

Tin whisker growth inhibition in RE-doped Sn-Zn soldered joints

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Keywords

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