TiN 纳米颗粒增强Sn 焊点的性能与组织研究

The wettability, mechanical properties and microstructure of Sn-xTiN (x = 0,0. 05,0. 1,0. 2,0. 3,0. 4,mass fraction,%)solder were studied by contact angle measuring instrument, universal testing machine and scanning electron microscopy (SEM). The results show that the wettability and the mechanical properties of the Sn solder joint are enhanced significantly by adding TiN nanoparticles. Ｗhen the addition content of TiN nanoparticles reaches 0. 2%,the contact angle of the solder decreases from the initial 16. 5° to 13. 8°,a decrease of 16.4%, and the shear strength of solder joint increases by 24.0%. Ｆor microstructures, the thickness of intermetallic compound (IMC)in Sn-xTiN / Cu solder joints decreases from the initial 6. 5 μm to 5. 8 μm with the addition of TiN nanoparticles. However,the interfacial IMC thickness of solder joints gradually increases with the addition of TiN nanoparticles.