Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system

F. Gao; C. P. Wang; X. J. Liu; K. Ishida

doi:10.1109/ICEPT.2007.4441439

Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system

F. Gao^*
, C. P. Wang
, X. J. Liu
, K. Ishida

^*Corresponding author for this work

Xiamen University
Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are added to the Pb-free solders to improve their performance. In the present work, the thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system were carried out using the CALPHAD method. Some examples of application are presented, and it is shown that the CALPHAD method is a good tool to design Pb-free solders and understand the interfacial reaction.

Original language	English
Title of host publication	Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs	https://doi.org/10.1109/ICEPT.2007.4441439
State	Published - 2007
Externally published	Yes
Event	2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China Duration: 14 Aug 2007 → 17 Aug 2007

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference	2007 8th International Conference on Electronic Packaging Technology, ICEPT
Country/Territory	China
City	Shanghai
Period	14/08/07 → 17/08/07

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10.1109/ICEPT.2007.4441439

Cite this

Gao, F., Wang, C. P., Liu, X. J., & Ishida, K. (2007). Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system. In Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT Article 4441439 (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/ICEPT.2007.4441439

@inproceedings{35ad984db9674b1799bc8c9e3501c3d3,

title = "Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system",

abstract = "Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are added to the Pb-free solders to improve their performance. In the present work, the thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system were carried out using the CALPHAD method. Some examples of application are presented, and it is shown that the CALPHAD method is a good tool to design Pb-free solders and understand the interfacial reaction.",

author = "F. Gao and Wang, \{C. P.\} and Liu, \{X. J.\} and K. Ishida",

year = "2007",

doi = "10.1109/ICEPT.2007.4441439",

language = "英语",

isbn = "1424413923",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

booktitle = "Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT",

note = "2007 8th International Conference on Electronic Packaging Technology, ICEPT ; Conference date: 14-08-2007 Through 17-08-2007",

}

Gao, F, Wang, CP, Liu, XJ & Ishida, K 2007, Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system. in Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT., 4441439, Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, Shanghai, China, 14/08/07. https://doi.org/10.1109/ICEPT.2007.4441439

Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system. / Gao, F.; Wang, C. P.; Liu, X. J. et al.
Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 2007. 4441439 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system

AU - Gao, F.

AU - Wang, C. P.

AU - Liu, X. J.

AU - Ishida, K.

PY - 2007

Y1 - 2007

N2 - Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are added to the Pb-free solders to improve their performance. In the present work, the thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system were carried out using the CALPHAD method. Some examples of application are presented, and it is shown that the CALPHAD method is a good tool to design Pb-free solders and understand the interfacial reaction.

AB - Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are added to the Pb-free solders to improve their performance. In the present work, the thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system were carried out using the CALPHAD method. Some examples of application are presented, and it is shown that the CALPHAD method is a good tool to design Pb-free solders and understand the interfacial reaction.

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DO - 10.1109/ICEPT.2007.4441439

M3 - 会议稿件

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SN - 1424413923

SN - 9781424413928

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT

T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT

Y2 - 14 August 2007 through 17 August 2007

ER -

Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system

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