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Thermodynamic Analysis of Comprehensive Performance of Carbon Dioxide(R744) and Its Mixture With Ethane(R170) Used in Refrigeration and Heating System at Low Evaporation Temperature

  • Dahan Sun*
  • , Zhongyan Liu
  • , Hao Zhang
  • , Xin Zhang
  • , Jiang Qin
  • *Corresponding author for this work
  • School of Energy Science and Engineering, Harbin Institute of Technology
  • Northeast Electric Power University

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, the system performance of R744 and R744/R170 mixed refrigerants used in a single-stage compression transcritical cycle at low evaporation temperature was studied by simulation method, and the effect of evaporation temperature, outlet temperature of gas cooler, R170 ratio on coefficient of performance (COP), discharge temperature, optimal pressure, and compression ratio were analyzed. The results show that Popt increases and decreases with the increase of outlet temperature and evaporation temperature of gas cooler and increases first and then decreases with the increase of R170 proportion. In the heating system, the maximum and minimum Popt of R744/R170 (25/75) were 1.35 MPa, 3.6 MPa, and 2.6 MPa and 1.23 MPa, 2.93 MPa, and 1.87 MPa lower than that of R170 (0%, 22.4%, and 50%); compared to pure R744, the system pressure of the mixed R744/R170 is lower. The COPe and COPh increase with the increase of evaporation temperature and decrease with the increase of outlet temperature of the gas cooler. With the increase of R170 proportion, they first decrease and then increase; the maximum COPe and COPh of R744 were 22.4%, 29.6%, and 21.2% and 10.3%, 13.8%, and 10.8% higher than those of R170 at 22.4%, 50% and 75%, respectively.

Original languageEnglish
Article number031003
JournalASME Open Journal of Engineering
Volume3
DOIs
StatePublished - 1 Jan 2024

Keywords

  • COP
  • R744/R170 refrigerant mixture
  • compression ratio
  • discharge temperature
  • heat pump
  • optimal pressure
  • refrigeration and air conditioning
  • thermal analysis

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