Thermo-physical properties of Sip/LD11 composites for electronic packaging

Zi Yang Xiu; Gao Hui Wu; Qiang Zhang; Mei Hui Song

Thermo-physical properties of Si_p/LD11 composites for electronic packaging

Zi Yang Xiu^*
, Gao Hui Wu
, Qiang Zhang
, Mei Hui Song

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

The Si_p/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Si _p/LD11 are decreased. The CTEs of Si_p/ LD11 can be adjusted between 8.3 × 10^-6-12 × 10^-6/C, and the thermal conductivity is larger than 87.7 W/ (m O. This meets the requirements of electronic packaging material. The CTEs of Si_p/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTEs of Si_p/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.

Original language	English
Pages (from-to)	227-230
Number of pages	4
Journal	Transactions of Nonferrous Metals Society of China (English Edition)
Volume	15
Issue number	SPEC. ISS. 2
State	Published - Apr 2005
Externally published	Yes

Keywords

Aluminum matrix composite
Si particles
Thermal conductivity
Thermal expansion

Cite this

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title = "Thermo-physical properties of Sip/LD11 composites for electronic packaging",

abstract = "The Sip/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Si p/LD11 are decreased. The CTEs of Sip/ LD11 can be adjusted between 8.3 {\texttimes} 10-6-12 {\texttimes} 10-6/C, and the thermal conductivity is larger than 87.7 W/ (m O. This meets the requirements of electronic packaging material. The CTEs of Sip/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTEs of Sip/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.",

keywords = "Aluminum matrix composite, Si particles, Thermal conductivity, Thermal expansion",

author = "Xiu, \{Zi Yang\} and Wu, \{Gao Hui\} and Qiang Zhang and Song, \{Mei Hui\}",

year = "2005",

month = apr,

language = "英语",

volume = "15",

pages = "227--230",

journal = "Transactions of Nonferrous Metals Society of China (English Edition)",

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number = "SPEC. ISS. 2",

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TY - JOUR

T1 - Thermo-physical properties of Sip/LD11 composites for electronic packaging

AU - Xiu, Zi Yang

AU - Wu, Gao Hui

AU - Zhang, Qiang

AU - Song, Mei Hui

PY - 2005/4

Y1 - 2005/4

N2 - The Sip/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Si p/LD11 are decreased. The CTEs of Sip/ LD11 can be adjusted between 8.3 × 10-6-12 × 10-6/C, and the thermal conductivity is larger than 87.7 W/ (m O. This meets the requirements of electronic packaging material. The CTEs of Sip/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTEs of Sip/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.

AB - The Sip/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Si p/LD11 are decreased. The CTEs of Sip/ LD11 can be adjusted between 8.3 × 10-6-12 × 10-6/C, and the thermal conductivity is larger than 87.7 W/ (m O. This meets the requirements of electronic packaging material. The CTEs of Sip/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTEs of Sip/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.

KW - Aluminum matrix composite

KW - Si particles

KW - Thermal conductivity

KW - Thermal expansion

UR - https://www.scopus.com/pages/publications/33846328813

M3 - 文章

AN - SCOPUS:33846328813

SN - 1003-6326

VL - 15

SP - 227

EP - 230

JO - Transactions of Nonferrous Metals Society of China (English Edition)

JF - Transactions of Nonferrous Metals Society of China (English Edition)

IS - SPEC. ISS. 2

ER -

Thermo-physical properties of Si_p/LD11 composites for electronic packaging

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Keywords

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