TY - GEN
T1 - Thermalmechanical behavior of PBGA package during laser and hot air reflow soldering
AU - Tian, Yanhong
AU - Wang, Chunqing
AU - Liu, Deming
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - In this presentation, temperature distribution in a laser reflowed solder balls and warpage of the package upon temperature change was simulated using a finite element method, effects of different laser heating processes on the temperature distribution were discussed in detail. Results of the simulation show that the reflowed solder balls by the laser heating power did not damage the silicon chip and the package while taking advantages of the laser short heating time. Lower temperature as well as smaller deformation were found within the package as comparing with the traditional heating method such as the hot air reflow. Also, experiments on the PBGA solder ball after laser reflow were carried out. Results show that the surface of the solder bumps by the laser reflow using optimized parameters is much smoother than that obtained by the hot air reflow process.
AB - In this presentation, temperature distribution in a laser reflowed solder balls and warpage of the package upon temperature change was simulated using a finite element method, effects of different laser heating processes on the temperature distribution were discussed in detail. Results of the simulation show that the reflowed solder balls by the laser heating power did not damage the silicon chip and the package while taking advantages of the laser short heating time. Lower temperature as well as smaller deformation were found within the package as comparing with the traditional heating method such as the hot air reflow. Also, experiments on the PBGA solder ball after laser reflow were carried out. Results show that the surface of the solder bumps by the laser reflow using optimized parameters is much smoother than that obtained by the hot air reflow process.
UR - https://www.scopus.com/pages/publications/84947467132
U2 - 10.1109/EMAP.2002.1188854
DO - 10.1109/EMAP.2002.1188854
M3 - 会议稿件
AN - SCOPUS:84947467132
T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
SP - 293
EP - 299
BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Y2 - 4 December 2002 through 6 December 2002
ER -