TY - GEN
T1 - Thermal structure coupling analysis and sensitivity optimization of the macro-micro motion platform
AU - Long, Zhili
AU - Liu, Sheng
AU - Zhang, Meng
AU - Dai, Xufei
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/9/28
Y1 - 2015/9/28
N2 - By using the finite element thermal analysis method, the mode of the structure coupling analysis of the macro-micro motion platform is established, and the connecting frame and the thermal characteristic of the connecting frame and the flexible hinge platform is analyzed. It is found that the deformation amount of the connecting frame and the flexible hinge increases at the field load condition with temperature by analyzing the coupling field. During optimizing the key component size of the connecting frame in the motion platform during the sensitivity analysis, the maximum deformation amount of the connecting frame decreases by 20% after the size optimization and the total quality decreases by 22.7%, and the maximum stress decreases by 31.1%. The result from thermal structure coupling analysis and sensitivity optimization can make the motion platform more accurate and stable.
AB - By using the finite element thermal analysis method, the mode of the structure coupling analysis of the macro-micro motion platform is established, and the connecting frame and the thermal characteristic of the connecting frame and the flexible hinge platform is analyzed. It is found that the deformation amount of the connecting frame and the flexible hinge increases at the field load condition with temperature by analyzing the coupling field. During optimizing the key component size of the connecting frame in the motion platform during the sensitivity analysis, the maximum deformation amount of the connecting frame decreases by 20% after the size optimization and the total quality decreases by 22.7%, and the maximum stress decreases by 31.1%. The result from thermal structure coupling analysis and sensitivity optimization can make the motion platform more accurate and stable.
KW - Finite Element Analysis
KW - Macro/Micro Motion Platform
KW - Sensitivity Optimization
KW - Thermal Structure Coupling Analysis
UR - https://www.scopus.com/pages/publications/84959870069
U2 - 10.1109/ICInfA.2015.7279825
DO - 10.1109/ICInfA.2015.7279825
M3 - 会议稿件
AN - SCOPUS:84959870069
T3 - 2015 IEEE International Conference on Information and Automation, ICIA 2015 - In conjunction with 2015 IEEE International Conference on Automation and Logistics
SP - 3124
EP - 3128
BT - 2015 IEEE International Conference on Information and Automation, ICIA 2015 - In conjunction with 2015 IEEE International Conference on Automation and Logistics
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 IEEE International Conference on Information and Automation, ICIA 2015 - In conjunction with 2015 IEEE International Conference on Automation and Logistics
Y2 - 8 August 2015 through 10 August 2015
ER -