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Thermal stress simulation in TiB2-Cu functionally graded materials

  • Xuebing Wang*
  • , Xinghong Zhang
  • , Shanyi Du
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalConference articlepeer-review

Abstract

A model for designing TiB2-Cu Functionally Graded Materials (FGM) was presented. The thermal stress in the steady-state was calculated with finite element method. To simulate the transient real using condition of FGM, a continuous stable heat flux is applied to the ceramic side of the model. By analyzing the thermal stress distribution along the gradient direction and the maximum stress distribution in both steady-state and transient temperature fields, the thermal stress relaxation in FGM, layered non-Functionally Graded Materials (nFGM) and homogeneous cermets were compared. The result showed that the optimized FGM has much better ability of anti-distortion and thermal stress relaxation than the nFGM.

Original languageEnglish
Pages (from-to)245-248
Number of pages4
JournalMaterials Science Forum
Volume423-425
StatePublished - 2003
EventProceedings of the Seventh International Symposium on Functionally Graded Materials - Beijing, China
Duration: 15 Oct 200218 Oct 2002

Keywords

  • Thermal stress simulation
  • Transient and steady-state

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