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Thermal stress analysis of SiCp/2024Al composites under different heat treatments

  • Yuan Yuan Han*
  • , Gao Hui Wu
  • , Feng Zhen Li
  • , Xiu Fang Wang
  • , De Ming Zhang
  • , Hong Bin Geng
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Harbin Institute of Technology
  • Harbin University of Science and Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The principle of thermal stress in the SiCp/2024Al composites under different heat treatments and the effect of heat treatment on the thermal residual stress are investigated. Thermal stress of SiC2/ 2024Al composites under both water quenching treatment and thermal-cold cycling treatment are numerically simulated by Marc finite element software. The result of numerical simulation showed that a great thermal stress field exists near the particle-matrix interface under heat treatment and the stress concentration near the SiC particle corner is produced. The thermal residual stress of composites after water quenching treatment is near to the σbof the matrix; however, the thermal residual stress of composites after thermal-cold cycling treatment decreases evidently.

Original languageEnglish
Pages (from-to)298-302
Number of pages5
JournalCailiao Kexue yu Gongyi/Material Science and Technology
Volume12
Issue number3
StatePublished - Jun 2004
Externally publishedYes

Keywords

  • Al matrix composites
  • SiC particle
  • Thermal residual stress
  • Thermal-cold cycling treatment

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