Thermal Stability and Microstructural Evolution of Cu Joints with an Ultra-Thin Sintered Layer

Low-temperature Cu sintering is used as a die-bonding strategy for the third-generation power device, and the Cu-sintered joints require long-term stability at elevated temperature. In this work, we investigate the thermal stability and microstructural evolution of the Cu interconnect joints with an ultra-thin sintered layer at the temperature of 250 °C in air. The as-prepared joint shows a dense well-bonded interface with low porosity before the thermal aging test. The average shear strength of the joints increases from 85.5 MPa to 91.3 MPa after aging up to 300 h. With further increase in aging time, the shear strength begins to decrease. However, the strength remains at a high level of 69.8 MPa even after 500 h of aging, satisfying the requirements for high-temperature stability. At short aging times, the porosity within the interface reduces slightly, and the fracture exhibits distinct ductile characteristics. When the aging time exceeds 300 h, the oxide content at the interface increases from the outer region toward the inner part, and aging cracks eventually appear at the edge of the sintered layer. Therefore, it is demonstrated that the dense and thin sintered layer limits oxygen diffusion, guaranteeing the high-temperature stability of the sintered joint.