Abstract
To investigate the reliability of solder joint by laser jet solder ball bonding method, Au/Cu soldering pads were bonded with Sn3.0Ag0.5Cu solder ball. The joint strength was tested by micro-strength tester, the interfacial microstructures were analyzed using SEM and EDX, and the influences of thermal shock treatment on the evolution of interfacial microstructure and joint strength were investigated as well. Results show that the Au finish cannot completely dissolve into solder during the process of solder jet ball bonding, which leads to the formation of multilayer structure of AuSn2+AuSn4. After thermal shock treatment, the residual Au layer vanishes and (Au, Sn, Cu) reactive layer forms, which leads to the reduction of joint strength.
| Original language | English |
|---|---|
| Pages (from-to) | 88-92 |
| Number of pages | 5 |
| Journal | Cailiao Kexue yu Gongyi/Material Science and Technology |
| Volume | 19 |
| Issue number | 3 |
| State | Published - Jun 2011 |
| Externally published | Yes |
Keywords
- Copper soldering pad
- Laser jet solder ball bonding
- SnAgCu
- Thermal shock test
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