Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging

Jiahao Liu; Lijin Qiu; Jixi Huang; Fangzhou Chen; Hongtao Chen; Wenjie Zhou

doi:10.1016/j.matlet.2026.140570

Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging

Jiahao Liu^*
, Lijin Qiu
, Jixi Huang
, Fangzhou Chen
, Hongtao Chen^*
, Wenjie Zhou

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
China Electronic Product Reliability and Environmental Testing Research Institute

Research output: Contribution to journal › Article › peer-review

Abstract

Severe thermal mismatch arising from frequent start-stop cycling of power devices induces periodic shear stress at the bondline, rendering conventional Sn-3Ag-0.5Cu (SAC305) solder-based bondlines susceptible to cracking under temperature shock loading. Herein, a novel interconnect material based on porous copper filled SAC305 was proposed. After 1200 temperature shock cycles, the bondline fabricated with porous Cu filled SAC305 exhibited a crack propagation rate of merely 36.4%, while its shear strength decreased from 45.6 MPa to 25.8 MPa. The results confirm that the porous Cu-filled SAC305 interconnect material possesses excellent temperature shock resistance, making it a promising candidate for high-reliability power device packaging.

Original language	English
Article number	140570
Journal	Materials Letters
Volume	415
DOIs	https://doi.org/10.1016/j.matlet.2026.140570
State	Published - 15 Jul 2026
Externally published	Yes

Keywords

Crack propagation rate
Porous copper
Shear strength
Sn-3Ag-0.5Cu
Thermal shock

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10.1016/j.matlet.2026.140570

Cite this

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title = "Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging",

abstract = "Severe thermal mismatch arising from frequent start-stop cycling of power devices induces periodic shear stress at the bondline, rendering conventional Sn-3Ag-0.5Cu (SAC305) solder-based bondlines susceptible to cracking under temperature shock loading. Herein, a novel interconnect material based on porous copper filled SAC305 was proposed. After 1200 temperature shock cycles, the bondline fabricated with porous Cu filled SAC305 exhibited a crack propagation rate of merely 36.4\%, while its shear strength decreased from 45.6 MPa to 25.8 MPa. The results confirm that the porous Cu-filled SAC305 interconnect material possesses excellent temperature shock resistance, making it a promising candidate for high-reliability power device packaging.",

keywords = "Crack propagation rate, Porous copper, Shear strength, Sn-3Ag-0.5Cu, Thermal shock",

author = "Jiahao Liu and Lijin Qiu and Jixi Huang and Fangzhou Chen and Hongtao Chen and Wenjie Zhou",

note = "Publisher Copyright: {\textcopyright} 2026",

year = "2026",

month = jul,

day = "15",

doi = "10.1016/j.matlet.2026.140570",

language = "英语",

volume = "415",

journal = "Materials Letters",

issn = "0167-577X",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging

AU - Liu, Jiahao

AU - Qiu, Lijin

AU - Huang, Jixi

AU - Chen, Fangzhou

AU - Chen, Hongtao

AU - Zhou, Wenjie

PY - 2026/7/15

Y1 - 2026/7/15

N2 - Severe thermal mismatch arising from frequent start-stop cycling of power devices induces periodic shear stress at the bondline, rendering conventional Sn-3Ag-0.5Cu (SAC305) solder-based bondlines susceptible to cracking under temperature shock loading. Herein, a novel interconnect material based on porous copper filled SAC305 was proposed. After 1200 temperature shock cycles, the bondline fabricated with porous Cu filled SAC305 exhibited a crack propagation rate of merely 36.4%, while its shear strength decreased from 45.6 MPa to 25.8 MPa. The results confirm that the porous Cu-filled SAC305 interconnect material possesses excellent temperature shock resistance, making it a promising candidate for high-reliability power device packaging.

AB - Severe thermal mismatch arising from frequent start-stop cycling of power devices induces periodic shear stress at the bondline, rendering conventional Sn-3Ag-0.5Cu (SAC305) solder-based bondlines susceptible to cracking under temperature shock loading. Herein, a novel interconnect material based on porous copper filled SAC305 was proposed. After 1200 temperature shock cycles, the bondline fabricated with porous Cu filled SAC305 exhibited a crack propagation rate of merely 36.4%, while its shear strength decreased from 45.6 MPa to 25.8 MPa. The results confirm that the porous Cu-filled SAC305 interconnect material possesses excellent temperature shock resistance, making it a promising candidate for high-reliability power device packaging.

KW - Crack propagation rate

KW - Porous copper

KW - Shear strength

KW - Sn-3Ag-0.5Cu

KW - Thermal shock

UR - https://www.scopus.com/pages/publications/105035678218

U2 - 10.1016/j.matlet.2026.140570

DO - 10.1016/j.matlet.2026.140570

M3 - 文章

AN - SCOPUS:105035678218

SN - 0167-577X

VL - 415

JO - Materials Letters

JF - Materials Letters

M1 - 140570

ER -

Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging

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Keywords

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