Abstract
A new kind of copper matrix composites with different volume fractions of β-eucryptite (Euc) particles was successfully fabricated by hot-pressed sintering. The microstructure of Euc/Cu composites was studied by scanning electron microscope and transmission electron microscope. The thermal physical properties of Euc/Cu composites were analyzed by means of thermal dilatometer and thermal conductivity tester. Results show that the effects of volume fraction of β-eucryptite particles on the thermal expansion coefficient and thermal conductivity of the composites are significant. When the volume fraction of β-eucryptite particles is more than 40%, the compactness of Euc/Cu composites decreases obviously. The thermal expansion coefficient of the composites is in the range of (9-15.4)×10-6/K, which is much lower than that of copper, and thermal conductivity of the composites is 50-170 W/m·K.
| Original language | English |
|---|---|
| Pages (from-to) | 225-228 |
| Number of pages | 4 |
| Journal | Cailiao Kexue yu Gongyi/Material Science and Technology |
| Volume | 18 |
| Issue number | 2 |
| State | Published - Apr 2010 |
| Externally published | Yes |
Keywords
- Copper matrix composite
- Hot-pressed sintering
- Thermal expansion coefficient
- β-eucryptite
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