Thermal, mechanical and shape memory properties of shape memory epoxy resin

Yuyan Liu; Chunmiao Han; Huifeng Tan; Xingwen Du

doi:10.1016/j.msea.2009.12.014

Thermal, mechanical and shape memory properties of shape memory epoxy resin

Yuyan Liu^*
, Chunmiao Han
, Huifeng Tan
, Xingwen Du

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

183 Scopus citations

Abstract

A series of shape memory epoxy resins (SMEPs) were prepared by epoxy and varying content of aromatic amine curing agent, for the purpose of application on space deployable structures. The thermal and mechanical properties of SMEPs were investigated by DSC, DMA and tensile test. Shape memory properties were also studied by an unusual method we called fold-deploy shape memory test. The effects of cross-linking density, recovery temperature and consecutive cycles on the shape memory properties were revealed through systematic variation of these factors. The results showed this series of SMEPs had high shape retention ratio (more than 99.5%) and shape recovery ratio (around 100%). Their T_g varied from 44.7 °C to 145.3 °C, users could choose as individual requirement.

Original language	English
Pages (from-to)	2510-2514
Number of pages	5
Journal	Materials Science and Engineering: A
Volume	527
Issue number	10-11
DOIs	https://doi.org/10.1016/j.msea.2009.12.014
State	Published - 25 Apr 2010

Keywords

Fold-deploy shape memory test
Shape memory epoxy
Shape memory property

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10.1016/j.msea.2009.12.014

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title = "Thermal, mechanical and shape memory properties of shape memory epoxy resin",

abstract = "A series of shape memory epoxy resins (SMEPs) were prepared by epoxy and varying content of aromatic amine curing agent, for the purpose of application on space deployable structures. The thermal and mechanical properties of SMEPs were investigated by DSC, DMA and tensile test. Shape memory properties were also studied by an unusual method we called fold-deploy shape memory test. The effects of cross-linking density, recovery temperature and consecutive cycles on the shape memory properties were revealed through systematic variation of these factors. The results showed this series of SMEPs had high shape retention ratio (more than 99.5\%) and shape recovery ratio (around 100\%). Their Tg varied from 44.7 °C to 145.3 °C, users could choose as individual requirement.",

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author = "Yuyan Liu and Chunmiao Han and Huifeng Tan and Xingwen Du",

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T1 - Thermal, mechanical and shape memory properties of shape memory epoxy resin

AU - Liu, Yuyan

AU - Han, Chunmiao

AU - Tan, Huifeng

AU - Du, Xingwen

PY - 2010/4/25

Y1 - 2010/4/25

N2 - A series of shape memory epoxy resins (SMEPs) were prepared by epoxy and varying content of aromatic amine curing agent, for the purpose of application on space deployable structures. The thermal and mechanical properties of SMEPs were investigated by DSC, DMA and tensile test. Shape memory properties were also studied by an unusual method we called fold-deploy shape memory test. The effects of cross-linking density, recovery temperature and consecutive cycles on the shape memory properties were revealed through systematic variation of these factors. The results showed this series of SMEPs had high shape retention ratio (more than 99.5%) and shape recovery ratio (around 100%). Their Tg varied from 44.7 °C to 145.3 °C, users could choose as individual requirement.

AB - A series of shape memory epoxy resins (SMEPs) were prepared by epoxy and varying content of aromatic amine curing agent, for the purpose of application on space deployable structures. The thermal and mechanical properties of SMEPs were investigated by DSC, DMA and tensile test. Shape memory properties were also studied by an unusual method we called fold-deploy shape memory test. The effects of cross-linking density, recovery temperature and consecutive cycles on the shape memory properties were revealed through systematic variation of these factors. The results showed this series of SMEPs had high shape retention ratio (more than 99.5%) and shape recovery ratio (around 100%). Their Tg varied from 44.7 °C to 145.3 °C, users could choose as individual requirement.

KW - Fold-deploy shape memory test

KW - Shape memory epoxy

KW - Shape memory property

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DO - 10.1016/j.msea.2009.12.014

M3 - 文章

AN - SCOPUS:77249110818

SN - 0921-5093

VL - 527

SP - 2510

EP - 2514

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

IS - 10-11

ER -

Thermal, mechanical and shape memory properties of shape memory epoxy resin

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Keywords

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