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Thermal fracture model for a functionally graded plate with a crack normal to the surfaces and arbitrary thermomechanical properties

  • Li Cheng Guo*
  • , Naotake Noda
  • , Linzhi Wu
  • *Corresponding author for this work
  • Shizuoka University
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The aim of this paper is to develop a general thermal fracture modelling method for a functionally graded plate (FGP) with a surface or embedded crack normal to the surfaces and arbitrary thermomechanical properties along the gradient direction. In the new model named as piecewise-exponential model (PE model), the FGP is modeled by dividing it into a multilayered medium with the mechanical properties varying exponentially in each layer and keeping continuous across the interfaces between layers. The thermal stress intensity factors (TSIFs) for some representative samples are presented. The results show that the variation profiles of the material property can significantly influence the fracture behavior of the FGP. Compared with the past piecewise homogeneous model, the advantages of the present PE model are discussed.

Original languageEnglish
Pages (from-to)1034-1041
Number of pages8
JournalComposites Science and Technology
Volume68
Issue number3-4
DOIs
StatePublished - Mar 2008

Keywords

  • B. Fracture
  • B. Modelling
  • B. Thermomechanical properties
  • C. Crack
  • Functionally graded material

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