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Thermal expansion behavior and thermal mismatch stress of aluminum matrix composite reinforced by β-eucryptite particle and aluminum borate whisker

  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

This paper described a study of the thermal expansion behavior in a new aluminum matrix composite containing both β-eucryptite particles and aluminum borate whiskers. The results of the measurements of the coefficient of thermal expansion (CTE) showed that the composite had both low thermal expansion coefficient and stringent dimensional stability at a wide temperature range. A simplified model was established and used to analyze the relation between thermal expansion behavior of the composite and thermal mismatch stresses in the whiskers and particles in the composite. Furthermore, the effect of interfacial reaction on the physical CTE of the composite was investigated with the help of transmission electronic microscopy (TEM).

Original languageEnglish
Pages (from-to)450-457
Number of pages8
JournalMaterials Chemistry and Physics
Volume85
Issue number2-3
DOIs
StatePublished - 15 Jun 2004
Externally publishedYes

Keywords

  • Composite
  • Interfacial reaction
  • Thermal expansion coefficient
  • Thermal mismatch stress

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