@inproceedings{517e099d00484af5a21d7076fd9116f8,
title = "Thermal design of switching mode power supply with multi-heat sources",
abstract = "Thermal design is the key process in reliability design of switching power supply. This paper focuses on solving the problem of reliability degradation caused by over-high temperature of switching power supply chips and the interactions among multi-heat sources. The thermal distribution of the switching power supply is analyzed in ANSYS software. The distribution map of temperature fields when power supply works stably is obtained. The temperature of chips tested by the infrared thermal imager agrees well with the simulation results. The optimization design is conducted including improvement of circuit topology, design of radiator parameters and mechanical design of power supply. The temperature of switching power supply chips is reduced and the temperature distribution of the power supply is ameliorated so that the reliability of the power supply is greatly improved. The research in this paper is of both academic and practical value.",
keywords = "ANSYS, Switching-mode power supply, Thermal analysis, Thermal design",
author = "Guofu Zhai and Yan Li and Wanbin Ren",
note = "Publisher Copyright: Copyright {\textcopyright} 2009 by International Academic Publishers Ltd.; 3rd International Conference on Reliability of Electrical Products and Electrical Contacts, ICREPEC 2009 ; Conference date: 18-10-2009 Through 21-10-2009",
year = "2009",
language = "英语",
series = "Proceedings of the 3rd International Conference on Reliability of Electrical Products and Electrical Contacts, ICREPEC 2009",
publisher = "International Academic Publishers",
pages = "440--444",
editor = "Jingying Zhao and Jingqin Wang",
booktitle = "Proceedings of the 3rd International Conference on Reliability of Electrical Products and Electrical Contacts, ICREPEC 2009",
}