@inproceedings{2300cdf46e2d4684a510b57f566949b4,
title = "Thermal Design Consideration of Medium Voltage High Frequency Transformers",
abstract = "This paper describes a thermal design using epoxy potting for high frequency transformer (HFT) for medium voltage high power electronic applications, namely emerging solid-state transformers. To address HFT's thermal stress problem, thermal performance of the HFT with air and epoxy potting cooling method are both simulated by magnetothermal-fluid coupling method (MTFCM). The effectiveness of the simulation analysis is verified in a 100 kW DC-DC resonant converter. Influencing factors including distance between the high frequency transformer and the metal enclosure, epoxy thermal conductivity and heat sink placements are simulated and analyzed. Finally, an optimal cooling structure is proposed for future high power HFTs.",
keywords = "epoxy potting, heat sink, HFT, MTFCM, thermal",
author = "Haoming Wang and Zhichen Guo and Tayebi, \{S. Milad\} and Xin Zhao and Qingyun Huang and Ruiyang Yu and Qingxin Yang and Yongjian Li and Huang, \{Alex Q.\}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 35th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2020 ; Conference date: 15-03-2020 Through 19-03-2020",
year = "2020",
month = mar,
doi = "10.1109/APEC39645.2020.9124264",
language = "英语",
series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "2721--2726",
booktitle = "APEC 2020 - 35th Annual IEEE Applied Power Electronics Conference and Exposition",
address = "美国",
}