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Thermal analysis for a crack problem in a functionally graded layered structure

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The thermal problem of a functionally graded layered structure with a crack intersecting the interface is studied. Analytical procedure is presented to obtain the thermal stress intensity factor (TSIF). The influences of the material nonhomogeneity constant and geometry parameters on the TSIF are analyzed. Particularly, the TSIF curves are provided when the crack center moves from one layer into another layer. It is found that the nonhomogeneity properties can influence the TSIF greatly.

Original languageEnglish
Title of host publicationAdvances in Heterogeneous Material Mechanics 2008 - 2nd International Conference on Heterogeneous Material Mechanics, ICHMM 2008
Pages1138-1141
Number of pages4
StatePublished - 2008
EventAdvances in Heterogeneous Material Mechanics 2008 - 2nd International Conference on Heterogeneous Material Mechanics, ICHMM 2008 - Huangshan, China
Duration: 3 Jun 20088 Jun 2008

Publication series

NameAdvances in Heterogeneous Material Mechanics 2008 - Proceedings of the 2nd International Conference on Heterogeneous Material Mechanics, ICHMM 2008

Conference

ConferenceAdvances in Heterogeneous Material Mechanics 2008 - 2nd International Conference on Heterogeneous Material Mechanics, ICHMM 2008
Country/TerritoryChina
CityHuangshan
Period3/06/088/06/08

Keywords

  • Crack
  • Functionally graded layered structure
  • Thermal stress intensity factor

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