Theoretical study on sawing force of ultrasonic vibration assisted diamond wire sawing (UAWS) based on abrasives wear

Wire saw cutting of monocrystalline silicon plays an important role in semiconductor manufacturing. The study of wire saw cutting silicon is important, and the grain wear has a great effect on the saw cutting force. Therefore, in this paper, considering abrasive wear on the wire saw, the ultrasonic vibration assisted sawing force theoretical model from a single abrasive to multiple abrasives is established. With the application of equal probability method, the surface profile model of wire saw is established. According to the abrasive wear law of wire saw, the finite element model (FEM) of wire saw with different abrasive wear is established. The influence of different abrasive wear on sawing force and workpiece surface morphology is analyzed by Abaqus. Finally, the experimental verification is carried out. The experimental results show that the sawing force of the ultrasonic vibration assisted diamond wire sawing (UAWS) decreases by 38% on average than that of the conventional diamond wire sawing (CWS), the surface roughness value is reduced, and the surface morphology is improved. With the increase of the abrasive wear value, the sawing force and the numbers of pits firstly decrease and then increase, the surface roughness value distribution firstly concentrates and then disperses, and the scratches show a smooth to intermittent trend.