TY - GEN
T1 - Theoretical study on power factor of Si/Ge multi-layer thermoelectric micro-cooler
AU - Han, Leilei
AU - Wang, Chunqing
AU - Hang, Chunjin
PY - 2012
Y1 - 2012
N2 - Thermoelectric (TE) micro-cooling is expected to solve the reliability problem caused by rapidly increasing packaging density of IC chips, but as the characteristic length approaching de Broglie wavelength of carriers, electrical transport will show great size effects, and consequently affect power factor, which is the numerator of TE figure of merit. In this paper, power factor of Si/Ge multi-layer TE micro-cooler has been investigated by 2-D Monte Carlo (MC) simulator GNU Archimedes. The results show that, as the thickness of monolayer approaching several nanometers, the quantum effects show great impact on electrical transport, causing electrical conductivity increase of about an order of magnitude, and Seebeck coefficient decrease of about 40% , hence, optimized thickness of multi-layer structures can make full use of quantum effects to enhance the power factor of TE devices.
AB - Thermoelectric (TE) micro-cooling is expected to solve the reliability problem caused by rapidly increasing packaging density of IC chips, but as the characteristic length approaching de Broglie wavelength of carriers, electrical transport will show great size effects, and consequently affect power factor, which is the numerator of TE figure of merit. In this paper, power factor of Si/Ge multi-layer TE micro-cooler has been investigated by 2-D Monte Carlo (MC) simulator GNU Archimedes. The results show that, as the thickness of monolayer approaching several nanometers, the quantum effects show great impact on electrical transport, causing electrical conductivity increase of about an order of magnitude, and Seebeck coefficient decrease of about 40% , hence, optimized thickness of multi-layer structures can make full use of quantum effects to enhance the power factor of TE devices.
UR - https://www.scopus.com/pages/publications/84875455542
U2 - 10.1109/ICEPT-HDP.2012.6474698
DO - 10.1109/ICEPT-HDP.2012.6474698
M3 - 会议稿件
AN - SCOPUS:84875455542
SN - 9781467316804
T3 - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
SP - 637
EP - 640
BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Y2 - 13 August 2012 through 16 August 2012
ER -