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Theoretical research on piezoresistive coefficients of polysilicon films

  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The piezoresistive coefficients of polysilicon films in monosilicon grains and grain boundaries are theoretically investigated by using stress decouple model. The expressions for the piezoresistive coefficients of polysilicon films are obtained. A comparison between the experimental and theoretical results is performed, and a better uniformity is achieved. The presented theory is helpful to theoretical analysis of the piezoresistive properties of polysilicon.

Original languageEnglish
Pages (from-to)292-296
Number of pages5
JournalPan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
Volume25
Issue number3
StatePublished - Mar 2004

Keywords

  • Piezoresistive coefficient
  • Polysilicon
  • Stress decouple model

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