Abstract
The piezoresistive coefficients of polysilicon films in monosilicon grains and grain boundaries are theoretically investigated by using stress decouple model. The expressions for the piezoresistive coefficients of polysilicon films are obtained. A comparison between the experimental and theoretical results is performed, and a better uniformity is achieved. The presented theory is helpful to theoretical analysis of the piezoresistive properties of polysilicon.
| Original language | English |
|---|---|
| Pages (from-to) | 292-296 |
| Number of pages | 5 |
| Journal | Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors |
| Volume | 25 |
| Issue number | 3 |
| State | Published - Mar 2004 |
Keywords
- Piezoresistive coefficient
- Polysilicon
- Stress decouple model
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