The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields

Yao Yang; Shaorong Li; Yuxin Liang; Bangsheng Li

doi:10.1016/j.matlet.2018.09.005

The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields

Yao Yang
, Shaorong Li
, Yuxin Liang
, Bangsheng Li^*

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

The wetting phenomenon of Sn-37Pb alloy solder spreading on Cu substrate under different ultrasonic fields was investigated. Sn-37Pb/Cu wetting systems showed significant precursor film characteristics with the assist of ultrasonic energy. A short-time ultrasonic field evidently enhanced the wettability of Sn-37Pb/Cu compare to a common wetting field which had no introduced ultrasonic. At the temperature of 213 °C, spreading area of a Sn-37Pb solder drop in a 20 kHz, 1000 W ultrasonic field reached maximum at 2 s, and showed significant precursor film characteristics. Atomistic dynamic models showed the relevance between wettability and precursor film formation. The observed dynamic results agreed with the experimental results.

Original language	English
Pages (from-to)	92-95
Number of pages	4
Journal	Materials Letters
Volume	234
DOIs	https://doi.org/10.1016/j.matlet.2018.09.005
State	Published - 1 Jan 2019

Keywords

Interfaces
Precursor film
Ultrasonic
Welding
Wetting kinetics

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10.1016/j.matlet.2018.09.005

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title = "The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields",

abstract = "The wetting phenomenon of Sn-37Pb alloy solder spreading on Cu substrate under different ultrasonic fields was investigated. Sn-37Pb/Cu wetting systems showed significant precursor film characteristics with the assist of ultrasonic energy. A short-time ultrasonic field evidently enhanced the wettability of Sn-37Pb/Cu compare to a common wetting field which had no introduced ultrasonic. At the temperature of 213 °C, spreading area of a Sn-37Pb solder drop in a 20 kHz, 1000 W ultrasonic field reached maximum at 2 s, and showed significant precursor film characteristics. Atomistic dynamic models showed the relevance between wettability and precursor film formation. The observed dynamic results agreed with the experimental results.",

keywords = "Interfaces, Precursor film, Ultrasonic, Welding, Wetting kinetics",

author = "Yao Yang and Shaorong Li and Yuxin Liang and Bangsheng Li",

note = "Publisher Copyright: {\textcopyright} 2018 Elsevier B.V.",

year = "2019",

month = jan,

day = "1",

doi = "10.1016/j.matlet.2018.09.005",

language = "英语",

volume = "234",

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journal = "Materials Letters",

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T1 - The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields

AU - Yang, Yao

AU - Li, Shaorong

AU - Liang, Yuxin

AU - Li, Bangsheng

PY - 2019/1/1

Y1 - 2019/1/1

N2 - The wetting phenomenon of Sn-37Pb alloy solder spreading on Cu substrate under different ultrasonic fields was investigated. Sn-37Pb/Cu wetting systems showed significant precursor film characteristics with the assist of ultrasonic energy. A short-time ultrasonic field evidently enhanced the wettability of Sn-37Pb/Cu compare to a common wetting field which had no introduced ultrasonic. At the temperature of 213 °C, spreading area of a Sn-37Pb solder drop in a 20 kHz, 1000 W ultrasonic field reached maximum at 2 s, and showed significant precursor film characteristics. Atomistic dynamic models showed the relevance between wettability and precursor film formation. The observed dynamic results agreed with the experimental results.

AB - The wetting phenomenon of Sn-37Pb alloy solder spreading on Cu substrate under different ultrasonic fields was investigated. Sn-37Pb/Cu wetting systems showed significant precursor film characteristics with the assist of ultrasonic energy. A short-time ultrasonic field evidently enhanced the wettability of Sn-37Pb/Cu compare to a common wetting field which had no introduced ultrasonic. At the temperature of 213 °C, spreading area of a Sn-37Pb solder drop in a 20 kHz, 1000 W ultrasonic field reached maximum at 2 s, and showed significant precursor film characteristics. Atomistic dynamic models showed the relevance between wettability and precursor film formation. The observed dynamic results agreed with the experimental results.

KW - Interfaces

KW - Precursor film

KW - Ultrasonic

KW - Welding

KW - Wetting kinetics

UR - https://www.scopus.com/pages/publications/85053433590

U2 - 10.1016/j.matlet.2018.09.005

DO - 10.1016/j.matlet.2018.09.005

M3 - 文章

AN - SCOPUS:85053433590

SN - 0167-577X

VL - 234

SP - 92

EP - 95

JO - Materials Letters

JF - Materials Letters

ER -

The wetting phenomenon and precursor film characteristics of Sn-37Pb/Cu under ultrasonic fields

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Keywords

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