@inproceedings{fdacd3ced6d84176bcf06ad3b191ce1a,
title = "The study of the growth behavior of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system during the ultrasonic-assisted transient liquid phase soldering",
abstract = "In this paper, the growth behavior of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system during the ultrasonic-assisted transient liquid phase soldering were investigated under various ultrasonic bonding time. Asymmetrical growth of the interfacial Cu6Sn5 was observed in the Cu/Sn/Cu solder joints, i.e., the Cu6Sn5 near the side of cavitation erosion grew randomly, while the Cu6Sn5 near the opposite side grew in layer type. The asymmetrical growth can be wholly ascribed to the asymmetrical ultrasonic effects across the entire Sn interlayer. The asymmetrical ultrasonic effects resulted in different conditions for the nucleation and growth behavior of Cu6Sn5 on the upper and lower Cu/Sn interfaces. The microstructure and mechanical properties of the resulted full intermetallic joint were also investigated.",
keywords = "Intermetallic compound, Mechanical properties, TLP soldering, Ultrasonic waves",
author = "Jihou Liu and Hongyun Zhao and Zhoulin Li and Xiaoguo Song",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046396",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "10--13",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
address = "美国",
}