@inproceedings{302a718c272948208aae5aa5b997649e,
title = "The research of spraying SiC/Cu electronic packaging composites",
abstract = "The SiC/Cu electronic packaging composites with excellent performance were successfully prepared by the chemical plating copper on the surface of SiC powders and high-speed flame spraying technology. The results showed that the homogeneous dense coated layers can be obtained on the surface of SiC powder by optimizing process parameters. The volume fraction of SiC powders in the composites could significantly increase and figure was beyond 55vol\% after spraying Copper. The SiC and Cu were the main phases in the spraying SiC/Cu electronic packaging composite, at the same time Cu2O can be tested as the trace phase. The interface combination properties of SiC/Cu in the hot-pressed samples can obviously improve. The thermal expansion coefficient and thermal conductivity of SiC/Cu electronic packaging composite basic can satisfy the requirements for electronic packaging materials.",
keywords = "Chemical plating copper, Micro-structure, SiC/Cu electronic packaging composites, Thermal physical properties, Thermal spraying",
author = "Ming Hu and Jing Gao and Yunlong Zhang",
year = "2011",
doi = "10.4028/www.scientific.net/AMR.284-286.620",
language = "英语",
isbn = "9783037851913",
series = "Advanced Materials Research",
pages = "620--623",
booktitle = "Materials and Design",
note = "2011 International Conference on Advanced Engineering Materials and Technology, AEMT 2011 ; Conference date: 29-07-2011 Through 31-07-2011",
}