The research of spraying SiC/(Al, Cu) electronic packaging composite materials

Ming Hu; Jia Ma; Jing Gao; Yunlong Zhang

doi:10.1166/asl.2012.4218

The research of spraying SiC/(Al, Cu) electronic packaging composite materials

Ming Hu^*
, Jia Ma
, Jing Gao
, Yunlong Zhang

^*Corresponding author for this work

Jiamusi University

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The SiC/(Al, Cu) electronic packaging composite materials with excellent performance were successfully prepared by combining with the group of surface modification, high-speed flame spray and hot pressing technology, as aluminum and copper as electronic packaging materials component. The results showed that the spraying SiC/(Al, Cu) electronic packaging composites are the forefront of electronic packaging materials nowadays.

Original language	English
Pages (from-to)	461-464
Number of pages	4
Journal	Advanced Science Letters
Volume	15
Issue number	1
DOIs	https://doi.org/10.1166/asl.2012.4218
State	Published - Aug 2012
Externally published	Yes

Keywords

Electronic packaging composite material
High-speed flame spraying
Microstructure
Thermal Physical property

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10.1166/asl.2012.4218

Cite this

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title = "The research of spraying SiC/(Al, Cu) electronic packaging composite materials",

abstract = "The SiC/(Al, Cu) electronic packaging composite materials with excellent performance were successfully prepared by combining with the group of surface modification, high-speed flame spray and hot pressing technology, as aluminum and copper as electronic packaging materials component. The results showed that the spraying SiC/(Al, Cu) electronic packaging composites are the forefront of electronic packaging materials nowadays.",

keywords = "Electronic packaging composite material, High-speed flame spraying, Microstructure, Thermal Physical property",

author = "Ming Hu and Jia Ma and Jing Gao and Yunlong Zhang",

year = "2012",

month = aug,

doi = "10.1166/asl.2012.4218",

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AU - Hu, Ming

AU - Ma, Jia

AU - Gao, Jing

AU - Zhang, Yunlong

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N2 - The SiC/(Al, Cu) electronic packaging composite materials with excellent performance were successfully prepared by combining with the group of surface modification, high-speed flame spray and hot pressing technology, as aluminum and copper as electronic packaging materials component. The results showed that the spraying SiC/(Al, Cu) electronic packaging composites are the forefront of electronic packaging materials nowadays.

AB - The SiC/(Al, Cu) electronic packaging composite materials with excellent performance were successfully prepared by combining with the group of surface modification, high-speed flame spray and hot pressing technology, as aluminum and copper as electronic packaging materials component. The results showed that the spraying SiC/(Al, Cu) electronic packaging composites are the forefront of electronic packaging materials nowadays.

KW - Electronic packaging composite material

KW - High-speed flame spraying

KW - Microstructure

KW - Thermal Physical property

UR - https://www.scopus.com/pages/publications/84864500905

U2 - 10.1166/asl.2012.4218

DO - 10.1166/asl.2012.4218

M3 - 文章

AN - SCOPUS:84864500905

SN - 1936-6612

VL - 15

SP - 461

EP - 464

JO - Advanced Science Letters

JF - Advanced Science Letters

IS - 1

ER -

The research of spraying SiC/(Al, Cu) electronic packaging composite materials

Abstract

Keywords

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