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The Measurement of the Elastic Modulus and Kinetic Friction Coefficient of Long Nanowires by the Micro-force Probe in the SEM Combined with Finite Element Simulation

  • Peng Gao
  • , Jian Gao
  • , Tao Zou
  • , Weibin Rong*
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

As an important nanomaterial, nanowires have important applications in micro-nano manufacturing, biomedicine, nano power generation and other fields, and are one of the current research hotspots. The traditional deformation-based nanowire dynamic friction measurement method only calculates the kinetic friction coefficient based on the deformation of the nanowire. However, due to the lack of force feedback, a certain pre-load force needs to be applied, which will also introduce errors and cause inaccurate measurement results. At the same time, it is easy to cause damage to the tungsten needles and nanowires, which is not suitable for nanowire samples with large aspect ratios. Aiming at the above problems, this paper proposes a method for measuring the elastic modulus and kinetic friction coefficient of Silicon (Si) nanowires (NWs) based on the combination of measurement of micro-force probes in the scanning electron microscope (SEM) and the simulation of the deflection of NWs. First, the corresponding relationship between the deformation of the nanowire and the force was obtained. Secondly, the influence of different elastic modulus and kinetic friction ratios on the deformation of nanowires were calculated by the simulation. Finally, the experimental data and simulation results are matched, and the elastic modulus and kinetic friction proportional coefficient with the smallest error is selected. The measurement method avoids the influence of the pre-load force on the measurement result, and at the same time avoids damage such as fracture of the nanowire and the probe due to excessive force. The effectiveness of this method is proven by comparing the measurement results in this article with the values in the relevant literature.

Original languageEnglish
Title of host publication2021 IEEE 4th International Conference on Nanoscience and Technology, ICNST 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages58-63
Number of pages6
ISBN (Electronic)9780738112886
DOIs
StatePublished - 2021
Event4th IEEE International Conference on Nanoscience and Technology, ICNST 2021 - Virtual, Chengdu, China
Duration: 26 Jun 202128 Jun 2021

Publication series

Name2021 IEEE 4th International Conference on Nanoscience and Technology, ICNST 2021

Conference

Conference4th IEEE International Conference on Nanoscience and Technology, ICNST 2021
Country/TerritoryChina
CityVirtual, Chengdu
Period26/06/2128/06/21

Keywords

  • Micro force probe
  • Si NWs
  • Side bending method
  • Simulation

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