TY - GEN
T1 - The influence of high melting point elements on the reliability of solder during thermal shocks
AU - Zhong, Ying
AU - Wang, Chunqing
AU - Zhao, Xiujuan
AU - Caers, J. F.J.M.
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/15
Y1 - 2015/7/15
N2 - The exploding use of high density and high temperature electronic devices is intensifying the desire for high temperature Pb-free solders. Alloying high melting point elements with conventional SnAgCu solders is one of the potential solutions drawing attention. The influence of high melting point elements (Ni, Sb, Bi) were studied by comparing the microstructure evolution of SnAgCuNiSbBi and SnAgCu solder joints during thermal shocks mainly by SEM and EBSD (also calculated Schmid Factor). Ni can strengthen the solder by Cu-Ni-Sn IMCs at the beginning of the thermal shocks, but its advantage becomes disadvantage after the IMCs are coarsened. Cu-Ni-Sn IMCs can act as the crystal nucleus to accelerate the recrystallization of the solder. Sb and Bi elements are soluble with Sn and act as solution strengthening elements. Higher residual stress in SACNSB solder offers more energy source for recrystallization and then more grain boundaries for easier crack propagation. So the fracture mode of the solder joints changed from the trans-granular fracture of SAC to inter-granular fracture of SACNSB.
AB - The exploding use of high density and high temperature electronic devices is intensifying the desire for high temperature Pb-free solders. Alloying high melting point elements with conventional SnAgCu solders is one of the potential solutions drawing attention. The influence of high melting point elements (Ni, Sb, Bi) were studied by comparing the microstructure evolution of SnAgCuNiSbBi and SnAgCu solder joints during thermal shocks mainly by SEM and EBSD (also calculated Schmid Factor). Ni can strengthen the solder by Cu-Ni-Sn IMCs at the beginning of the thermal shocks, but its advantage becomes disadvantage after the IMCs are coarsened. Cu-Ni-Sn IMCs can act as the crystal nucleus to accelerate the recrystallization of the solder. Sb and Bi elements are soluble with Sn and act as solution strengthening elements. Higher residual stress in SACNSB solder offers more energy source for recrystallization and then more grain boundaries for easier crack propagation. So the fracture mode of the solder joints changed from the trans-granular fracture of SAC to inter-granular fracture of SACNSB.
UR - https://www.scopus.com/pages/publications/84942155763
U2 - 10.1109/ECTC.2015.7159902
DO - 10.1109/ECTC.2015.7159902
M3 - 会议稿件
AN - SCOPUS:84942155763
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2162
EP - 2167
BT - 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Y2 - 26 May 2015 through 29 May 2015
ER -