Abstract
This study investigates AlGaN/GaN high-electron-mobility transistors (HEMTs) irradiated with chlorine ions of varying energies, which introduces depth-dependent non-uniform defects beneath the gate electrode. By combining experimental and simulation methods, we systematically analyze three distinct degradation phenomena: non-uniform degradation in transfer characteristics, threshold voltage (Vth) shift saturation, and peak transconductance (GM) collapse. Through current deep-level transient spectroscopy (I-DLTS), electrical performance measurement, and technology computer aided design (TCAD) device simulation, along with band theory analysis, it is found that high fluence chlorine irradiation generates FeGa-VN defects (EC-0.5 eV) in the GaN layer, inducing Fermi-level pinning at these trap states. The increased defect concentration causes interfacial band bending and reduces Two-dimensional electron gas (2DEG) density. Donor defect E1 near the AlGaN/GaN interface is identified as the primary contributor to Vth shift saturation behavior. Additionally, VN- VN (+1/+2) defects (EC -0.77 eV) in the AlGaN barrier layer become activated when the gate voltage exceeds a critical value, significantly enhancing electron capture from the conduction band. This spatially non-uniform trapping process leads to gate-voltage-dependent degradation of drain current (Ids) and ultimately results in the phenomenon of peak GM collapse.
| Original language | English |
|---|---|
| Pages (from-to) | 314-322 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Nuclear Science |
| Volume | 73 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2026 |
| Externally published | Yes |
Keywords
- Complex defects
- GaN-high-electron-mobility transistors (HEMTs)
- displacement damage
- heavy ion irradiation
- non-uniform
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