TY - GEN
T1 - The impact of defect formed in hot-cutting process on reliability of ceramic packaging and a novel structure design concept
AU - Zeng, Chao
AU - Wang, Chunqing
AU - Tian, Yanhong
AU - Kong, Lingchao
PY - 2007
Y1 - 2007
N2 - This paper investigates the defect formed by the mechanical cutting processing of green sheet of alumina ceramic by evaluating the surface integrity in terms of surface morphology, and the flexural strength and its variance. The Weibull strength distribution method is introduced to compare the strength between defect-contained specimens and specimens without hot-cutting defect. Experimental results show that the defect causes a remarkable decline in strength and small specimens are more affected than big ones. The surface contains the hot-cutting defect is more dangerous than the natural surface. A FEM method (ANSYS) is utilized to quantitatively evaluate residual stresses of the ceramic insulator in brazing process. Based on the stress analysis, a Defect-Free-Stress design concept is put forward to give some guidance to structure design and material selection.
AB - This paper investigates the defect formed by the mechanical cutting processing of green sheet of alumina ceramic by evaluating the surface integrity in terms of surface morphology, and the flexural strength and its variance. The Weibull strength distribution method is introduced to compare the strength between defect-contained specimens and specimens without hot-cutting defect. Experimental results show that the defect causes a remarkable decline in strength and small specimens are more affected than big ones. The surface contains the hot-cutting defect is more dangerous than the natural surface. A FEM method (ANSYS) is utilized to quantitatively evaluate residual stresses of the ceramic insulator in brazing process. Based on the stress analysis, a Defect-Free-Stress design concept is put forward to give some guidance to structure design and material selection.
UR - https://www.scopus.com/pages/publications/50249105129
U2 - 10.1109/ICEPT.2007.4441525
DO - 10.1109/ICEPT.2007.4441525
M3 - 会议稿件
AN - SCOPUS:50249105129
SN - 1424413923
SN - 9781424413928
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT
Y2 - 14 August 2007 through 17 August 2007
ER -