The Formation of Nano Compounds during Sn/Cu Wetting

Shaorong Li; Yao Yang; Yuxin Liang; Bangsheng Li

doi:10.1088/1757-899X/452/2/022020

The Formation of Nano Compounds during Sn/Cu Wetting

Shaorong Li
, Yao Yang^*
, Yuxin Liang
, Bangsheng Li

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Harbin Institute of Technology

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

When soldering copper-based chips in electronic industry, the growth of tin whisker on Sn/Cu interface under compressive stress was caused by nano-size intermetallic compounds (IMC), Cu₆Sn₅. Reactive wetting process of Cu substrate by pure Sn was observed in an experimental device, and its kinetic mechanism was investigated by performing molecular dynamics calculations. When Sn/Cu wetting was assisted with ultrasonic vibrations, the vertical growth of nano-size Cu₆Sn₅ particles won solid-liquid interface was inhibited, so the occurrence of a new compound Cu₃Sn in ultrasonic wetting which changed the morphology of interface, was beneficial to eliminate tin whisker on Sn/Cu interface.

Original language	English
Article number	022020
Journal	IOP Conference Series: Materials Science and Engineering
Volume	452
Issue number	2
DOIs	https://doi.org/10.1088/1757-899X/452/2/022020
State	Published - 13 Dec 2018
Event	2018 3rd International Conference on Insulating Materials, Material Application and Electrical Engineering, IMMAEE 2018 - Melbourne, Australia Duration: 15 Sep 2018 → 16 Sep 2018

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title = "The Formation of Nano Compounds during Sn/Cu Wetting",

abstract = "When soldering copper-based chips in electronic industry, the growth of tin whisker on Sn/Cu interface under compressive stress was caused by nano-size intermetallic compounds (IMC), Cu6Sn5. Reactive wetting process of Cu substrate by pure Sn was observed in an experimental device, and its kinetic mechanism was investigated by performing molecular dynamics calculations. When Sn/Cu wetting was assisted with ultrasonic vibrations, the vertical growth of nano-size Cu6Sn5 particles won solid-liquid interface was inhibited, so the occurrence of a new compound Cu3Sn in ultrasonic wetting which changed the morphology of interface, was beneficial to eliminate tin whisker on Sn/Cu interface.",

author = "Shaorong Li and Yao Yang and Yuxin Liang and Bangsheng Li",

note = "Publisher Copyright: {\textcopyright} Published under licence by IOP Publishing Ltd.; 2018 3rd International Conference on Insulating Materials, Material Application and Electrical Engineering, IMMAEE 2018 ; Conference date: 15-09-2018 Through 16-09-2018",

year = "2018",

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doi = "10.1088/1757-899X/452/2/022020",

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T1 - The Formation of Nano Compounds during Sn/Cu Wetting

AU - Li, Shaorong

AU - Yang, Yao

AU - Liang, Yuxin

AU - Li, Bangsheng

N1 - Publisher Copyright: © Published under licence by IOP Publishing Ltd.

PY - 2018/12/13

Y1 - 2018/12/13

N2 - When soldering copper-based chips in electronic industry, the growth of tin whisker on Sn/Cu interface under compressive stress was caused by nano-size intermetallic compounds (IMC), Cu6Sn5. Reactive wetting process of Cu substrate by pure Sn was observed in an experimental device, and its kinetic mechanism was investigated by performing molecular dynamics calculations. When Sn/Cu wetting was assisted with ultrasonic vibrations, the vertical growth of nano-size Cu6Sn5 particles won solid-liquid interface was inhibited, so the occurrence of a new compound Cu3Sn in ultrasonic wetting which changed the morphology of interface, was beneficial to eliminate tin whisker on Sn/Cu interface.

AB - When soldering copper-based chips in electronic industry, the growth of tin whisker on Sn/Cu interface under compressive stress was caused by nano-size intermetallic compounds (IMC), Cu6Sn5. Reactive wetting process of Cu substrate by pure Sn was observed in an experimental device, and its kinetic mechanism was investigated by performing molecular dynamics calculations. When Sn/Cu wetting was assisted with ultrasonic vibrations, the vertical growth of nano-size Cu6Sn5 particles won solid-liquid interface was inhibited, so the occurrence of a new compound Cu3Sn in ultrasonic wetting which changed the morphology of interface, was beneficial to eliminate tin whisker on Sn/Cu interface.

UR - https://www.scopus.com/pages/publications/85063380112

U2 - 10.1088/1757-899X/452/2/022020

DO - 10.1088/1757-899X/452/2/022020

M3 - 会议文章

AN - SCOPUS:85063380112

SN - 1757-8981

VL - 452

JO - IOP Conference Series: Materials Science and Engineering

JF - IOP Conference Series: Materials Science and Engineering

IS - 2

M1 - 022020

T2 - 2018 3rd International Conference on Insulating Materials, Material Application and Electrical Engineering, IMMAEE 2018

Y2 - 15 September 2018 through 16 September 2018

ER -

The Formation of Nano Compounds during Sn/Cu Wetting

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