The evolution of interface structure in TLP bonded joints of Al 2O3p/6061Al composites with Cu/Ni/Cu interlayers

Jiuchun Yan; Zhiwu Xu; Gaohui Wu; Shiqin Yang

doi:10.1007/s10853-005-4394-1

The evolution of interface structure in TLP bonded joints of Al ₂O_3p/6061Al composites with Cu/Ni/Cu interlayers

Jiuchun Yan^*
, Zhiwu Xu
, Gaohui Wu
, Shiqin Yang

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

An investigatory study was conducted to observe the evolution of interface structure in transient liquid phase (TLP) bonded joints of Al₂O _3p/6061Al composites with Cu/Ni/Cu interlayers. The materials used were cylindrical rods of Al-MMCs. The morphologies, chemical composition and structures of the phases formed in TLP bonded joints were investigated by scanning electron microscopy (SEM) and x-ray diffraction (XRD). The results show that with the continuance of the diffusion process, the composition of the Al-Cu liquid phase adjacent to Al-MMCs deviates from the eutectic point, and an Al-based solid solution layer forms during solidification.

Original language	English
Pages (from-to)	5307-5309
Number of pages	3
Journal	Journal of Materials Science
Volume	40
Issue number	19
DOIs	https://doi.org/10.1007/s10853-005-4394-1
State	Published - Oct 2005

Access to Document

10.1007/s10853-005-4394-1

Cite this

@article{19d393f67e4441d3844788bb36335e0e,

title = "The evolution of interface structure in TLP bonded joints of Al 2O3p/6061Al composites with Cu/Ni/Cu interlayers",

abstract = "An investigatory study was conducted to observe the evolution of interface structure in transient liquid phase (TLP) bonded joints of Al2O 3p/6061Al composites with Cu/Ni/Cu interlayers. The materials used were cylindrical rods of Al-MMCs. The morphologies, chemical composition and structures of the phases formed in TLP bonded joints were investigated by scanning electron microscopy (SEM) and x-ray diffraction (XRD). The results show that with the continuance of the diffusion process, the composition of the Al-Cu liquid phase adjacent to Al-MMCs deviates from the eutectic point, and an Al-based solid solution layer forms during solidification.",

author = "Jiuchun Yan and Zhiwu Xu and Gaohui Wu and Shiqin Yang",

year = "2005",

month = oct,

doi = "10.1007/s10853-005-4394-1",

language = "英语",

volume = "40",

pages = "5307--5309",

journal = "Journal of Materials Science",

issn = "0022-2461",

publisher = "Springer",

number = "19",

}

TY - JOUR

T1 - The evolution of interface structure in TLP bonded joints of Al 2O3p/6061Al composites with Cu/Ni/Cu interlayers

AU - Yan, Jiuchun

AU - Xu, Zhiwu

AU - Wu, Gaohui

AU - Yang, Shiqin

PY - 2005/10

Y1 - 2005/10

N2 - An investigatory study was conducted to observe the evolution of interface structure in transient liquid phase (TLP) bonded joints of Al2O 3p/6061Al composites with Cu/Ni/Cu interlayers. The materials used were cylindrical rods of Al-MMCs. The morphologies, chemical composition and structures of the phases formed in TLP bonded joints were investigated by scanning electron microscopy (SEM) and x-ray diffraction (XRD). The results show that with the continuance of the diffusion process, the composition of the Al-Cu liquid phase adjacent to Al-MMCs deviates from the eutectic point, and an Al-based solid solution layer forms during solidification.

AB - An investigatory study was conducted to observe the evolution of interface structure in transient liquid phase (TLP) bonded joints of Al2O 3p/6061Al composites with Cu/Ni/Cu interlayers. The materials used were cylindrical rods of Al-MMCs. The morphologies, chemical composition and structures of the phases formed in TLP bonded joints were investigated by scanning electron microscopy (SEM) and x-ray diffraction (XRD). The results show that with the continuance of the diffusion process, the composition of the Al-Cu liquid phase adjacent to Al-MMCs deviates from the eutectic point, and an Al-based solid solution layer forms during solidification.

UR - https://www.scopus.com/pages/publications/26244457813

U2 - 10.1007/s10853-005-4394-1

DO - 10.1007/s10853-005-4394-1

M3 - 文章

AN - SCOPUS:26244457813

SN - 0022-2461

VL - 40

SP - 5307

EP - 5309

JO - Journal of Materials Science

JF - Journal of Materials Science

IS - 19

ER -

The evolution of interface structure in TLP bonded joints of Al ₂O_3p/6061Al composites with Cu/Ni/Cu interlayers

Abstract

Access to Document

Other files and links

Fingerprint

Cite this