Abstract
In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explained as the adsorbing-hindering effect of surface-active Nd atoms which blocked the growth of brittle intermetallic compounds (IMCs) in the solder joint. Theoretical analysis indicated that 0.05 wt. % addition of Nd could distinctly decrease the growth constant of Cu6Sn5 IMCs and slightly decrease the growth constant of Cu3Sn IMCs respectively. The shear force of SAC387-0.05Nd/Cu solder joint was evidently improved compared with the origin solder joint. In addition, SAC387-0.05Nd/Cu solder joint maintained excellent mechanical property compared with SAC387/Cu solder joint even after 1440 h aging treatment.
| Original language | English |
|---|---|
| Article number | 8935 |
| Pages (from-to) | 1-9 |
| Number of pages | 9 |
| Journal | Applied Sciences (Switzerland) |
| Volume | 10 |
| Issue number | 24 |
| DOIs | |
| State | Published - 2 Dec 2020 |
Keywords
- Aging
- Microstructure
- Nd
- Shear force
- Sn-Ag-Cu
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