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The effects of B2O3content and Ca/Si ratio on the densification behavior and microwave dielectric properties of the CaO-B2O3-SiO2glass-ceramics for LTCC application

  • Chao Dong
  • , Tingnan Yan
  • , Jiwen Xu*
  • , Zhaojun Li
  • , Rong Sun
  • , Dawei Wang*
  • *Corresponding author for this work
  • Shenzhen Institute of Advanced Technology
  • Guilin University of Electronic Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, the sintering behavior, crystallization, densification, and microwave dielectric properties of CaO-B2O3-SiO2 (CBS) glass-ceramics have been systematically studied with different Ca/Si ratios and B2O3 contents. TMA curves demonstrated that with increasing B2O3 content from 1.5 mol% to 16.5 mol%, the softening temperature (TS) was decreased from 776.5 °C to 691.5 °C, and the shrinking rate was increased from 13.81% to 30.32%, then decreased to 11.25%. With further increasing Ca/Si ratio from 1 to 1.30, the sintering behavior was greatly improved with the linear shrinkage increasing from 11.25% to 53.22%, which led to the increase of ϵr from 5.563 to 6.469 and decrease of tanδ from 1.99 × 10-3 to 1.54 × 10-3. Especially, the CBS glass-ceramics with Ca/Si ratio of 1.20 and B2O3 content of 16.5 mol% sintered at 850°C for 30 min exhibited excellent microwave dielectric properties, with ϵr ~ 6.092 (@11.37GHz), tanδ ~ 9.69× 10-4 and Q×f ~ 11737.47 GHz, τf ~ -17 ppm/°C, which are attractive for LTCC substrate application.

Original languageEnglish
Title of host publication2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665499057
DOIs
StatePublished - 2022
Externally publishedYes
Event23rd International Conference on Electronic Packaging Technology, ICEPT 2022 - Dalian, China
Duration: 10 Aug 202213 Aug 2022

Publication series

Name2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022

Conference

Conference23rd International Conference on Electronic Packaging Technology, ICEPT 2022
Country/TerritoryChina
CityDalian
Period10/08/2213/08/22

Keywords

  • CaO-BO-SiO
  • LTCC
  • glass-ceramics
  • microwave dielectric properties

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