@inproceedings{414e47beccc849109ef15f0568a785b7,
title = "The effect of thickness and annealing time on surface segregation in cu/ni, ni/cu film/substrate and cu/ni/si film/film/substrate",
abstract = "The Cu/Ni, Ni/Cu and Cu/Ni/Si film/substrate and film/film/substrate systems were prepared by magnetron sputtering method to investigate the surface segregation. The chemical composition of film was analyzed by Auger Electron Spectroscopy (AES). The microtopographies of the Cu/Ni surface and the cross section of the film were observed by Transmission Electron Microscope (TEM), where the blocky distribution of Ni-rich area on surface of Cu film and columnar grains was observed in the specimen. It is found that the thickness of sputtered film has stronger effect on the composition of segregation layer near the surface than that of the annealing time. The surface segregation could be ascribed to the fast vertical diffusion of the substrate atoms through the columnar grain boundaries and the subsequent lateral surface diffusion.",
keywords = "Annealing time, Film thickness, Interlayer diffusion, Surface segregation",
author = "Y. Lu and Wang, \{C. P.\} and F. Kong and T. Dai and Zhao, \{C. C.\} and Liu, \{Xing Jun\}",
note = "Publisher Copyright: {\textcopyright} (2015) Trans Tech Publications, Switzerland.; 9th International Forum on Advanced Material Science and Technology, IFAMST9 2014 ; Conference date: 30-11-2014 Through 03-12-2014",
year = "2015",
doi = "10.4028/www.scientific.net/MSF.833.181",
language = "英语",
isbn = "9783038355960",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "181--184",
editor = "Xiaopeng Xiong and Ran Zhang",
booktitle = "Applied Materials and Technologies",
address = "瑞士",
}